- 您现在的位置：买卖IC网 > PDF目录15527 > ADSP-3PARCBF548E02 (Analog Devices Inc)KIT DEV STARTER BF548 PDF资料下载
参数资料
| 型号： | ADSP-3PARCBF548E02 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 14/100页 |
| 文件大小： | 0K |
| 描述： | KIT DEV STARTER BF548 |
| 产品培训模块： | Arcturus uCBF54x-EMM |
| 特色产品： | uCBF54x Start Kit and System Module by Arcturus |
| 标准包装： | 1 |
| 系列： | Blackfin® |
| 类型： | DSP |
| 适用于相关产品： | ADSP-BF548 |
| 所含物品： | 板，线缆，CD，带麦克风的耳机，模块，电源 |
| 相关产品： | ADSP-BF548MBBCZ-5M-ND - IC DSP 533MHZ W/DDR 400CSPBGA ADSP-BF548BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGA |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页当前第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页
Rev. C
|
Page 20 of 100
|
February 2010
ADSP-BF542/ADSP-BF544/ADSP-BF547/ADSP-BF548/ADSP-BF549
modes, the processor actively loads data from parallel or serial
memories. In slave boot modes, the processor receives data
from an external host device.
The boot modes listed in Table 9 provide a number of mecha-
nisms for automatically loading the processor’s internal and
external memories after a reset. By default, all boot modes use
the slowest allowed configuration settings. Default settings can
be altered via the initialization code feature at boot time or by
proper OTP programming at pre-boot time. Some boot modes
require a boot host wait (HWAIT) signal, which is a GPIO out-
put signal that is driven and toggled by the boot kernel at boot
time. If pulled high through an external pull-up resistor, the
HWAIT signal behaves active high and will be driven low when
the processor is ready for data. Conversely, when pulled low,
HWAIT is driven high when the processor is ready for data.
When the boot sequence completes, the HWAIT pin can be
used for other purposes. By default, HWAIT functionality is on
GPIO port B (PB11). However, if PB11 is otherwise utilized in
the system, an alternate boot host wait (HWAITA) signal can be
enabled on GPIO port H (PH7) by programming the
OTP_ALTERNATE_HWAIT bit in the PBS00L OTP
memory page.
The BMODE pins of the reset configuration register, sampled
during power-on resets and software-initiated resets, imple-
ment the following modes:
Idle-no boot mode (BMODE = 0x0)—In this mode, the
processor goes into the idle state. The idle boot mode helps
to recover from illegal operating modes, in case the OTP
memory is misconfigured.
Boot from 8- or 16-bit external flash memory—
(BMODE = 0x1)—In this mode, the boot kernel loads the
first block header from address 0x2000 0000 and, depend-
ing on instructions contained in the header, the boot kernel
performs an 8- or 16-bit boot or starts program execution
at the address provided by the header. By default, all con-
figuration settings are set for the slowest device possible (3-
cycle hold time; 15-cycle R/W access times; 4-cycle setup).
The ARDY pin is not enabled by default. It can, however,
be enabled by OTP programming. Similarly, all interface
behavior and timings can be customized through OTP pro-
gramming. This includes activation of burst-mode or page-
mode operation. In this mode, all asynchronous interface
signals are enabled at the port muxing level.
Boot from 16-bit asynchronous FIFO (BMODE = 0x2)—In
this mode, the boot kernel starts booting from address
0x2030 0000. Every 16-bit word that the boot kernel has to
read from the FIFO must be requested by a low pulse on
the DMAR1 pin.
Boot from serial SPI memory, EEPROM or flash
(BMODE = 0x3)—8-, 16-, 24- or 32-bit addressable devices
are supported. The processor uses the PE4 GPIO pin to
select a single SPI EEPROM or flash device and uses SPI0
to submit a read command and successive address bytes
(0x00) until a valid 8-, 16-, 24-, or 32-bit addressable device
is detected. Pull-up resistors are required on the SPI0SEL1
and SPI0MISO pins. By default, a value of 0x85 is written to
the SPI0_BAUD register.
Boot from SPI host device (BMODE = 0x4)—The proces-
sor operates in SPI slave mode (using SPI0) and is
configured to receive the bytes of the .LDR file from an SPI
host (master) agent. The HWAIT signal must be interro-
gated by the host before every transmitted byte. A pull-up
resistor is required on the SPI0SS input. A pull-down resis-
tor on the serial clock (SPI0SCK) may improve signal
quality and booting robustness.
Boot from serial TWI memory, EEPROM or flash
(BMODE = 0x5)—The processor operates in master mode
(using TWI0) and selects the TWI slave with the unique ID
0xA0. The processor submits successive read commands to
the memory device starting at two-byte internal address
0x0000 and begins clocking data into the processor. The
TWI memory device should comply with Philips I2C Bus
Specification version 2.1 and have the capability to auto-
increment its internal address counter such that the con-
tents of the memory device can be read sequentially. By
default, a prescale value of 0xA and CLKDIV value of
0x0811 is used. Unless altered by OTP settings, an I2C
memory that takes two address bytes is assumed. Develop-
ment tools ensure that data that is booted to memories that
cannot be accessed by the Blackfin core is written to an
intermediate storage place and then copied to the final des-
tination via memory DMA.
Boot from TWI host (BMODE = 0x6)—The TWI host
agent selects the slave with the unique ID 0x5F. The proces-
sor (using TWI0) replies with an acknowledgement, and
the host can then download the boot stream. The TWI host
agent should comply with Philips I2C Bus Specification ver-
Table 9. Booting Modes
BMODE3– 0 Description
0000
Idle-no boot
0001
Boot from 8- or 16-bit external flash memory
0010
Boot from 16-bit asynchronous FIFO
0011
Boot from serial SPI memory (EEPROM or flash)
0100
Boot from SPI host device
0101
Boot from serial TWI memory (EEPROM or flash)
0110
Boot from TWI host
0111
Boot from UART host
1000
Reserved
1001
Reserved
1010
Boot from DDR SDRAM/Mobile DDR SDRAM
1011
Boot from OTP memory
1100
Reserved
1101
Boot from 8- or 16-bit NAND flash memory via NFC
1110
Boot from 16-bit host DMA
1111
Boot from 8-bit host DMA
相关PDF资料 |
PDF描述 |
|---|---|
| ECM25DCTI-S288 | CONN EDGECARD 50POS .156 EXTEND |
| GCM18DTKI-S288 | CONN EDGECARD 36POS .156 EXTEND |
| UCC3957MTR-2 | IC LI-ION PROTECT CIRCUIT 16QSOP |
| GBM28DRMI-S288 | CONN EDGECARD 56POS .156 EXTEND |
| UCC3957MTR-1G4 | IC LI-ION PROTECT CIRCUIT 16QSOP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ADSP-3PARCBF548M01 | 功能描述:MODULE BOARD BF548 RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器或微处理器模块 系列:Blackfin® 产品目录绘图:DLP-245SY-G 标准包装:1 系列:USB 模块/板类型:开发板 适用于相关产品:USB 其它名称:813-1006 |
| ADSP-BF504BCPZ-3F | 功能描述:IC CCD SIGNAL PROCESSOR 88LFCSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:Blackfin® 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI，以太网，RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA，FCBGA 供应商设备封装:431-FCPBGA（20x20） 包装:托盘 |
| ADSP-BF504BCPZ-4 | 功能描述:IC CCD SIGNAL PROCESSOR 88LFCSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:Blackfin® 标准包装:40 系列:TMS320DM64x, DaVinci™ 类型:定点 接口:I²C，McASP，McBSP 时钟速率:400MHz 非易失内存:外部 芯片上RAM:160kB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:0°C ~ 90°C 安装类型:表面贴装 封装/外壳:548-BBGA，FCBGA 供应商设备封装:548-FCBGA（27x27） 包装:托盘 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA |
| ADSP-BF504BCPZ-4F | 功能描述:IC CCD SIGNAL PROCESSOR 88LFCSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:Blackfin® 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI，以太网，RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA，FCBGA 供应商设备封装:431-FCPBGA（20x20） 包装:托盘 |
| ADSP-BF504KCPZ-3F | 功能描述:IC CCD SIGNAL PROCESSOR 88LFCSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:Blackfin® 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI，以太网，RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA，FCBGA 供应商设备封装:431-FCPBGA（20x20） 包装:托盘 |
发布紧急采购，3分钟左右您将得到回复。