参数资料
型号: ADSP-BF533SBBC500
厂商: Analog Devices Inc
文件页数: 13/64页
文件大小: 0K
描述: IC DSP CTLR 16B 500MHZ 160CSPBGA
产品培训模块: Blackfin® Processor Core Architecture Overview
Blackfin® Device Drivers
Blackfin® Optimizations for Performance and Power Consumption
Blackfin® System Services
标准包装: 1
系列: Blackfin®
类型: 定点
接口: SPI,SSP,UART
时钟速率: 500MHz
非易失内存: ROM(1 kB)
芯片上RAM: 148kB
电压 - 输入/输出: 3.30V
电压 - 核心: 1.20V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 160-LFBGA,CSPBGA
供应商设备封装: 160-CSPBGA(12x12)
包装: 托盘
配用: ADZS-BFAUDIO-EZEXT-ND - BOARD EVAL AUDIO BLACKFIN
ADZS-BFAV-EZEXT-ND - BOARD DAUGHT ADSP-BF533,37,61KIT
ADZS-BF533-EZLITE-ND - KIT W/BOARD EVAL FOR ADSP-BF533
ADSP-BF531 / ADSP-BF532 / ADSP-BF533
t NOM is the duration running at f CCLKNOM
t RED is the duration running at f CCLKRED
The percent power savings is calculated as:
% power savings = ? 1 – power savings factor ? ? 100%
VOLTAGE REGULATION
The Blackfin processor provides an on-chip voltage regulator
that can generate appropriate V DDINT voltage levels from the
V DDEXT supply. See Operating Conditions on Page 20 for regula-
tor tolerances and acceptable V DDEXT ranges for specific models.
Figure 7 shows the typical external components required to
complete the power management system. The regulator con-
trols the internal logic voltage levels and is programmable with
the voltage regulator control register (VR_CTL) in increments
of 50 mV. To reduce standby power consumption, the internal
voltage regulator can be programmed to remove power to the
processor core while keeping I/O power (V DDEXT ) supplied.
While in the hibernate state, I/O power is still being applied,
eliminating the need for external buffers. The voltage regulator
can be activated from this power-down state either through an
For further details on the on-chip voltage regulator and related
board design guidelines, see the Switching Regulator Design
Considerations for ADSP-BF533 Blackfin Processors (EE-228)
applications note on the Analog Devices web site ( www.ana-
log.com )—use site search on “EE-228”.
CLOCK SIGNALS
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors can
be clocked by an external crystal, a sine wave input, or a buff-
ered, shaped clock derived from an external clock oscillator.
If an external clock is used, it should be a TTL-compatible signal
and must not be halted, changed, or operated below the speci-
fied frequency during normal operation. This signal is
connected to the processor’s CLKIN pin. When an external
clock is used, the XTAL pin must be left unconnected.
Alternatively, because the processors include an on-chip oscilla-
tor circuit, an external crystal can be used. For fundamental
frequency operation, use the circuit shown in Figure 8 .
Blackfin
RTC wakeup or by asserting RESET, both of which initiate a
boot sequence. The regulator can also be disabled and bypassed
at the user’s discretion.
CLKOUT
EN
TO PLL CIRCUITRY
V DDEXT
(LOW-INDUCTANCE)
SET OF DECOUPLING
CAPACITORS
700
100μF
+
V DDEXT
CLKIN
XTAL
0 *
V DDEXT
1M
100nF
10μH
100μF
+
FDS9431A
+
V DDINT
18pF*
18pF*
FOR OVERTONE
OPERATION ONLY
10μF
100μF
LOW ESR
ZHCS1000
VR OUT
NOTE: VALUES MARKED WITH * MUST BE CUSTOMIZED
DEPENDING ON THE CRYSTAL AND LAYOUT. PLEASE
ANALYZE CAREFULLY.
SHORT AND LOW-
INDUCTANCE WIRE
NOTE: DESIGNER SHOULD MINIMIZE
TRACE LENGTH TO FDS9431A.
Figure 7. Voltage Regulator Circuit
VR OUT
GND
Figure 8. External Crystal Connections
A parallel-resonant, fundamental frequency, microprocessor-
grade crystal is connected across the CLKIN and XTAL pins.
The on-chip resistance between CLKIN and the XTAL pin is in
the 500 k ? range. Further parallel resistors are typically not rec-
ommended. The two capacitors and the series resistor shown in
Voltage Regulator Layout Guidelines
Regulator external component placement, board routing, and
bypass capacitors all have a significant effect on noise injected
into the other analog circuits on-chip. The VROUT1–0 traces
and voltage regulator external components should be consid-
ered as noise sources when doing board layout and should not
be routed or placed near sensitive circuits or components on the
board. All internal and I/O power supplies should be well
bypassed with bypass capacitors placed as close to the proces-
sors as possible.
Figure 8 fine tune the phase and amplitude of the sine fre-
quency. The capacitor and resistor values shown in Figure 8 are
typical values only. The capacitor values are dependent upon
the crystal manufacturer's load capacitance recommendations
and the physical PCB layout. The resistor value depends on the
drive level specified by the crystal manufacturer. System designs
should verify the customized values based on careful investiga-
tion on multiple devices over the allowed temperature range.
A third-overtone crystal can be used at frequencies above
25 MHz. The circuit is then modified to ensure crystal operation
only at the third overtone, by adding a tuned inductor circuit as
shown in Figure 8 .
Rev. I
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Page 13 of 64 |
August 2013
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