参数资料
型号: ADSP-TS201SABP-050
厂商: Analog Devices Inc
文件页数: 40/48页
文件大小: 0K
描述: IC PROCESSOR 500MHZ 576BGA
标准包装: 1
系列: TigerSHARC®
类型: 定点/浮点
接口: 主机接口,连接端口,多处理器
时钟速率: 500MHz
非易失内存: 外部
芯片上RAM: 3MB
电压 - 输入/输出: 2.50V
电压 - 核心: 1.05V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 576-BBGA 裸露焊盘
供应商设备封装: 576-BGA-ED(25x25)
包装: 托盘
配用: ADZS-TS201S-EZLITE-ND - KIT LITE EVAL FOR ADSP-TS201S
ADSP-TS201S
Rev. C
|
Page 45 of 48
|
December 2006
OUTLINE DIMENSIONS
The ADSP-TS201S processor is available in a 25 mm × 25 mm,
576-ball metric thermally enhanced ball grid array (BGA_ED)
package with 24 rows of balls (BP-576).
SURFACE MOUNT DESIGN
Table 36 is provided as an aid to PCB design. For industry-
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Figure 47. 576-Ball BGA_ED (BP-576)
1.00
BSC
(BALL
PITCH)
0.75
0.65
0.55
(BALL
DIAMETER)
DETAIL A
NOTES:
1. ALL DIMENSIO NS ARE IN MILL IMET ERS.
2. THE ACTUAL PO SITION OF THE BAL L GR ID IS W ITHIN 0.25 m m OF ITS
IDEAL POSITIO N RELATIVE TO THE PACKAGE EDGES.
3. CENTER DIMENSIONS ARE N OMINAL.
4. THIS PACKAG E C ONFO RMS TO JEDEC MS-034 SPECIF ICATIO N.
SEATING PLANE
1.60 MAX
0.20 MAX
DETAIL A
0.97 BSC
7
95
3
1
11
13
15
17
21 19
23
6
8
10
12
14
16
18
20
24 22
42
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
Y
W
V
U
T
AD
AC
AB
AA
23.00
BSC
SQ
25.20
25.00
24.80
25.20
25.00
24.80
TOP VIEW
BOTTOM VIEW
1.00
BSC
0.60
0.50
0.40
1.00
BSC
A1 BALL
INDICATOR
1.25
1.00
0.75
1.25
1.00
0.75
3.10
2.94
2.78
Table 36. BGA Data for Use with Surface Mount Design
Package
Ball Attach Type
Solder Mask Opening
Ball Pad Size
576-Ball BGA_ED
(BP-576)
Nonsolder Mask Defined (NSMD)
0.69 mm diameter
0.56 mm diameter
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