参数资料
型号: ADSP-TS203SABPZ050
厂商: Analog Devices Inc
文件页数: 41/48页
文件大小: 0K
描述: IC PROCESSOR 500MHZ 576BGA
标准包装: 1
系列: TigerSHARC®
类型: 定点/浮点
接口: 主机接口,连接端口,多处理器
时钟速率: 500MHz
非易失内存: 外部
芯片上RAM: 512kB
电压 - 输入/输出: 2.50V
电压 - 核心: 1.05V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 576-BBGA 裸露焊盘
供应商设备封装: 576-BGA-ED(25x25)
包装: 托盘
Rev. D
|
Page 46 of 48
|
May 2012
OUTLINE DIMENSIONS
The ADSP-TS203S processor is available in a 25 mm
× 25 mm,
576-ball metric thermally enhanced ball grid array (BGA_ED)
package with 24 rows of balls (BP-576).
SURFACE MOUNT DESIGN
The following table is provided as an aide to PCB design. The
numbers listed in the table are for reference purposes and
should not supersede the PCB design rules. Please reference
IPC-7351, Surface Mount Design and Land Pattern Standard,
for PCB design recommendations.
Figure 45. 576-Ball BGA_ED (BP-576)
1.00
BSC
(BALL
PITCH)
0.75
0.65
0.55
(BALL
DIAMETER)
DETAIL A
NOTES:
1. ALL DIMENSIO NS ARE IN MILL IMET ERS.
2. THE ACTUAL PO SITION OF THE BAL L GR ID IS W ITHIN 0.25 m m OF ITS
IDEAL POSITIO N RELATIVE TO THE PACKAGE EDGES.
3. CENTER DIMENSIONS ARE N OMINAL.
4. THIS PACKAG E C ONFO RMS TO JEDEC MS-034 SPECIF ICATIO N.
SEATING PLANE
1.60 MAX
0.20 MAX
DETAIL A
0.97 BSC
7
95
3
1
11
13
15
17
21 19
23
6
8
10
12
14
16
18
20
24 22
42
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
Y
W
V
U
T
AD
AC
AB
AA
23.00
BSC
SQ
25.20
25.00
24.80
25.20
25.00
24.80
TOP VIEW
BOTTOM VIEW
1.00
BSC
0.60
0.50
0.40
1.00
BSC
A1 BALL
INDICATOR
1.25
1.00
0.75
1.25
1.00
0.75
3.10
2.94
2.78
Package
Ball Attach Type
Solder Mask
Opening
Ball Pad Size
576-Ball BGA_ED
(BP-576-1)
Nonsolder Mask
Defined (NSMD)
0.69
0.56
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