参数资料
型号: ADUC843BCPZ8-3
厂商: Analog Devices Inc
文件页数: 71/88页
文件大小: 0K
描述: IC MCU FLASH 12BIT ADC 56LFCSP
标准包装: 1
系列: MicroConverter® ADuC8xx
核心处理器: 8052
芯体尺寸: 8-位
速度: 8.38MHz
连通性: I²C,SPI,UART/USART
外围设备: DMA,PSM,PWM,温度传感器,WDT
输入/输出数: 32
程序存储器容量: 8KB(8K x 8)
程序存储器类型: 闪存
RAM 容量: 2.25K x 8
电压 - 电源 (Vcc/Vdd): 2.7 V ~ 3.6 V
数据转换器: A/D 8x12b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 56-VFQFN 裸露焊盘,CSP
包装: 托盘
ADuC841/ADuC842/ADuC843
Rev. 0 | Page 73 of 88
If access to more than 64 kBytes of RAM is desired, a feature
unique to the ADuC841/ADuC842/ADuC843 allows address-
ing up to 16 MBytes of external RAM simply by adding an
additional latch as illustrated in Figure 79.
LATCH
P2
ALE
P0
LATCH
SRAM
A8–A15
A0–A7
D0–D7
(DATA)
A16–A23
OE
RD
WE
WR
ADuC841/
ADuC842/
ADuC843
03260-0-079
Figure 79. External Data Memory Interface (16 MBytes Address Space)
In either implementation, Port 0 (P0) serves as a multiplexed
address/data bus. It emits the low byte of the data pointer (DPL)
as an address, which is latched by a pulse of ALE prior to data
being placed on the bus by the ADuC841/ADuC842/ADuC843
(write operation) or by the SRAM (read operation). Port 2 (P2)
provides the data pointer page byte (DPP) to be latched by ALE,
followed by the data pointer high byte (DPH). If no latch is
connected to P2, DPP is ignored by the SRAM, and the 8051
standard of 64 kBytes external data memory access is maintained.
Power Supplies
The operational power supply voltage of the parts depends on
whether the part is the 3 V version or the 5 V version. The
specifications are given for power supplies within 2.7 V to 3.6 V
or ±5% of the nominal 5 V level.
Note that Figure 80 and Figure 81 refer to the PQFP package.
For the CSP package, connect the extra DVDD, DGND, AVDD,
and AGND in the same manner. Also, the paddle on the bottom
of the package should be soldered to a metal plate to provide
mechanical stability. This metal plate should not be connected
to ground.
Separate analog and digital power supply pins (AVDD and DVDD,
respectively) allow AVDD to be kept relatively free of the noisy
digital signals that are often present on the system DVDD line.
However, though you can power AVDD and DVDD from two
separate supplies if desired, you must ensure that they remain
within ±0.3 V of one another at all times to avoid damaging the
chip (as per the Absolute Maximum Ratings section). Therefore,
it is recommended that unless AVDD and DVDD are connected
directly together, back-to-back Schottky diodes should be con-
nected between them, as shown in Figure 80.
DVDD
AGND
AVDD
+
0.1
F
10
F
ANALOG SUPPLY
10
F
DGND
0.1
F
DIGITAL SUPPLY
+
ADuC841/
ADuC842/
ADuC843
03260-0-080
Figure 80. External Dual-Supply Connections
As an alternative to providing two separate power supplies, the
user can help keep AVDD quiet by placing a small series resistor
and/or ferrite bead between it and DVDD, and then decoupling
AVDD separately to ground. An example of this configuration is
shown in Figure 81. With this configuration, other analog
circuitry (such as op amps and voltage reference) can be powered
from the AVDD supply line as well. The user will still want to
include back-to-back Schottky diodes between AVDD and DVDD
to protect them from power-up and power-down transient
conditions that could momentarily separate the two supply voltages.
DVDD
AGND
AVDD
DGND
DIGITAL SUPPLY
+
BEAD
1.6
0.1
F
0.1
F
10
F
10
F
ADuC841/
ADuC842/
ADuC843
03260-0-081
Figure 81. External Single-Supply Connections
Notice that in both Figure 80 and Figure 81, a large value
(10 F) reservoir capacitor sits on DVDD and a separate 10 F
capacitor sits on AVDD. Also, local small-value (0.1 F) capaci-
tors are located at each VDD pin of the chip. As per standard
design practice, be sure to include all of these capacitors, and
ensure the smaller capacitors are close to each AVDD pin with
trace lengths as short as possible. Connect the ground terminal
of each of these capacitors directly to the underlying ground
plane. Finally, note that at all times, the analog and digital ground
pins on the part must be referenced to the same system ground
reference point.
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