参数资料
型号: ADV3003ACPZ-R7
厂商: Analog Devices Inc
文件页数: 7/16页
文件大小: 0K
描述: IC EQUALZR HDMI/DVI TMDS 40LFCSP
标准包装: 750
应用: DVI,HDMI 均衡器/驱动器
接口: TMDS
电源电压: 3 V ~ 3.6 V
封装/外壳: 40-VFQFN 裸露焊盘,CSP
供应商设备封装: 40-LFCSP-VQ(6x6)
包装: 带卷 (TR)
安装类型: 表面贴装
ADV3003
Rev. 0 | Page 15 of 16
OUTLINE DIMENSIONS
1
40
10
11
31
30
21
20
4.25
4.10 SQ
3.95
TOP
VIEW
6.00
BSC SQ
PIN 1
INDICATOR
5.75
BSC SQ
12° MAX
0.30
0.23
0.18
0.20 REF
SEATING
PLANE
1.00
0.85
0.80
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.80 MAX
0.65 TYP
4.50
REF
0.50
0.40
0.30
0.50
BSC
PIN 1
INDICATOR
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOT TOM VIEW)
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
01
28
08
-A
*THE ADV3003 HAS A CONDUCTIVE HEAT SLUG (ePAD) TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF
THE DEVICE OVER THE FULL HDMI/DVI TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO AVEE. IT IS RECOMMENDED THAT NO PCB SIGNAL TRACES
OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE SLUG.
ATTACHING THE SLUG TO AN AVEE POWER PLANE REDUCES THE JUNCTION TEMPERATURE OF THE DEVICE WHICH
MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
Figure 29. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
6 mm × 6 mm Body, Very Thin Quad
(CP-40-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature
Range
Package Description
Package
Option
Ordering
Quantity
40°C to +85°C
40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-40-1
490
ADV3003ACPZ-R71
40°C to +85°C
40-Lead Lead Frame Chip Scale Package [LFCSP_VQ], Reel 7
CP-40-1
1500
ADV3003-EVALZ1
Evaluation Board
1 Z = RoHS Compliant Part.
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