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参数资料
型号： AGLN030V2-FQNG48
元件分类： FPGA
英文描述： FPGA, PQCC48
封装： 6 X 6 MM, 0.90 HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-48
文件页数： 20/114页
文件大小： 3991K
代理商： AGLN030V2-FQNG48
IGLOO nano Device Overview
Ad vance v0.4
1-9
Part Number and Revision Date
Part Number 51700110-001-3
Revised December 2008
List of Changes
The following table lists critical changes that were made in the current version of the document.
Previous Version
Changes in Current Version (Advance v0.4)
Page
Advance v0.3
(November 2008)
The second table note in the "IGLOO nano Devices" table was revised to state,
"AGLN060, AGLN125, and AGLN250 in the CS81 package do not support PLLs.
AGLN030 and smaller devices do not support this feature."
I
The I/Os per package for CS81 were revised to 60 for AGLN060, AGLN125, and
AGLN250 in the "I/Os Per Package"table.
II
Advance v0.2
(October 2008)
The "Advanced I/Os" section was updated to include wide power supply voltage
support for 1.14 V to 1.575 V.
I
The AGLN030 device was added to product tables and replaces AGL030 entries
that were formerly in the tables.
I to IV
The "I/Os Per Package"table was updated for the CS81 package to change the
number of I/Os for AGLN060, AGLN125, and AGLN250 from 66 to 64.
II
The "Wide Range I/O Support" section is new.
1-8
Advance v0.1
(October 2008)
The following tables and sections were updated to add the UC81 and CS81
packages for AGL030:
"IGLOO nano Devices"
"I/Os Per Package"
"IGLOO nano Product Available in the Z Feature Grade"
"Temperature Grade Offerings"
N/A
The "I/Os Per Package" table was updated to add the following information to
table note 4: "For nano devices, the VQ100 package is offered in both leaded and
RoHS-compliant versions. All other packages are RoHS-compliant only."
II
The "IGLOO nano Product Available in the Z Feature Grade" section was updated
to remove QN100 for AGLN250.
IV
The device architecture figures, Figure 1-3 IGLOO Device Architecture Overview
with Two I/O Banks (AGLN060, AGLN125) through Figure 1-4 IGLOO Device
Architecture
Overview
with
Four
I/O
Banks
(AGLN250),
were
revised.
Figure 1-1 IGLOO Device Architecture Overview with Two I/O Banks and No RAM
(AGLN010 and AGLN030) is new.
1-4
through
1-5
The "PLL and CCC" section was revised to include information about CCC-GLs in
AGLN020 and smaller devices.
1-7
The "I/Os with Advanced I/O Standards" section was revised to add information
about IGLOO nano devices supporting double-data-rate applications.
1-8
相关PDF资料
PDF描述
AGLN030V2-FQNG68 FPGA, PQCC68
AGLN030V2-FUC81 FPGA, PBGA81
AGLN030V2-FUCG81 FPGA, PBGA81
AGLN030V2-FVQ100 FPGA, PQFP100
AGLN030V2-FVQG100 FPGA, PQFP100
相关代理商/技术参数
参数描述
AGLN030V2-ZCSG81 功能描述:IC FPGA NANO 1KB 30K 81-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
AGLN030V2-ZCSG81I 功能描述:IC FPGA NANO 1KB 30K 81-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
AGLN030V2-ZQNG48 功能描述:IC FPGA NANO 1KB 30K 48-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
AGLN030V2-ZQNG48I 功能描述:IC FPGA NANO 1KB 30K 48-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
AGLN030V2-ZQNG68 功能描述:IC FPGA NANO 1KB 30K 68-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
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