参数资料
型号: AGLN030V2-FQNG48
元件分类: FPGA
英文描述: FPGA, PQCC48
封装: 6 X 6 MM, 0.90 HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-48
文件页数: 21/114页
文件大小: 3991K
代理商: AGLN030V2-FQNG48
IGLOO nano Device Overview
1- 10
Advance v0.4
Datasheet Categories
Categories
In order to provide the latest information to designers, some datasheets are published before data
has been fully characterized. Datasheets are designated as "Product Brief," "Advance,"
"Preliminary," and "Production." The definition of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advance or production) and contains
general product information. This document gives an overview of specific device and family
information.
Advance
This version contains initial estimated information based on simulation, other products, devices, or
speed grades. This information can be used as estimates, but not for production. This label only
applies to the DC and Switching Characteristics chapter of the datasheet and will only be used
when the data has not been fully characterized.
Preliminary
The datasheet contains information based on simulation and/or initial characterization. The
information is believed to be correct, but changes are possible.
Unmarked (production)
This version contains information that is considered to be final.
Export Administration Regulations (EAR)
The products described in this document are subject to the Export Administration Regulations
(EAR). They could require an approved export license prior to export from the United States. An
export includes release of product or disclosure of technology to a foreign national inside or
outside the United States.
Actel Safety Critical, Life Support, and High-Reliability
Applications Policy
The Actel products described in this advance status document may not have completed Actel’s
qualification process. Actel may amend or enhance products during the product introduction and
qualification process, resulting in changes in device functionality or performance. It is the
responsibility of each customer to ensure the fitness of any Actel product (but especially a new
product) for a particular purpose, including appropriateness for safety-critical, life-support, and
other high-reliability applications. Consult Actel’s Terms and Conditions for specific liability
exclusions relating to life-support applications. A reliability report covering all of Actel’s products is
available on the Actel website at http://www.actel.com/documents/ORT_Report.pdf. Actel also
offers a variety of enhanced qualification and lot acceptance screening procedures. Contact your
local Actel sales office for additional reliability information.
相关PDF资料
PDF描述
AGLN030V2-FQNG68 FPGA, PQCC68
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相关代理商/技术参数
参数描述
AGLN030V2-ZCSG81 功能描述:IC FPGA NANO 1KB 30K 81-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLN030V2-ZCSG81I 功能描述:IC FPGA NANO 1KB 30K 81-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLN030V2-ZQNG48 功能描述:IC FPGA NANO 1KB 30K 48-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLN030V2-ZQNG48I 功能描述:IC FPGA NANO 1KB 30K 48-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLN030V2-ZQNG68 功能描述:IC FPGA NANO 1KB 30K 68-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)