参数资料
| 型号： | AGLP125V2-CSG289I |
| 厂商： | Microsemi SoC |
| 文件页数： | 134/134页 |
| 文件大小： | 0K |
| 描述： | IC FPGA IGLOO PLUS 125K 289-CSP |
| 标准包装： | 152 |
| 系列： | IGLOO PLUS |
| 逻辑元件/单元数： | 3120 |
| RAM 位总计： | 36864 |
| 输入/输出数： | 212 |
| 门数： | 125000 |
| 电源电压： | 1.14 V ~ 1.575 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 289-TFBGA，CSBGA |
| 供应商设备封装： | 289-CSP（14x14） |
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IGLOO PLUS Low Power Flash FPGAs
Revision 16
3-5
Special Function Pins
NC
No Connect
This pin is not connected to circuitry within the device. These pins can be driven to any voltage or can be
left floating with no effect on the operation of the device.
DC
Do Not Connect
This pin should not be connected to any signals on the PCB. These pins should be left unconnected.
Packaging
Semiconductor technology is constantly shrinking in size while growing in capability and functional
integration. To enable next-generation silicon technologies, semiconductor packages have also evolved
to provide improved performance and flexibility.
Microsemi consistently delivers packages that provide the necessary mechanical and environmental
protection to ensure consistent reliability and performance. Microsemi IC packaging technology
efficiently supports high-density FPGAs with large-pin-count Ball Grid Arrays (BGAs), but is also flexible
enough to accommodate stringent form factor requirements for Chip Scale Packaging (CSP). In addition,
Microsemi offers a variety of packages designed to meet your most demanding application and economic
requirements for today's embedded and mobile systems.
Related Documents
The following documents provide packaging information and device selection for low power flash
devices.
Lists devices currently recommended for new designs and the packages available for each member of
the family. Use this document or the datasheet tables to determine the best package for your design, and
which package drawing to use.
This document contains the package mechanical drawings for all packages currently or previously
supplied by Microsemi. Use the bookmarks to navigate to the package mechanical drawings.
Additional packaging materials are available at
相关PDF资料 |
PDF描述 |
|---|---|
| ASC43DREH-S734 | CONN EDGECARD 86POS .100 EYELET |
| M1A3P1000-FG256 | IC FPGA M1 1KB FLASH 1M 256FBGA |
| FMC13DREN | CONN EDGECARD 26POS .100 EYELET |
| APA150-BG456 | IC FPGA PROASIC+ 150K 456-PBGA |
| FMC13DREH | CONN EDGECARD 26POS .100 EYELET |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AGLP125-V2CSG289PP | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology |
| AGLP125-V2FCS289 | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology |
| AGLP125-V2FCS289ES | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology |
| AGLP125-V2FCS289I | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology |
| AGLP125-V2FCS289PP | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology |
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