参数资料
型号: AH115
元件分类: 放大器
英文描述: 1800 MHz - 2300 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
封装: SMT, SOIC-8
文件页数: 3/4页
文件大小: 127K
代理商: AH115
This document contains information on a new product.
Specifications and information are subject to change without notice
WJ Communications, Inc.
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
April 2003
The Communications Edge
TM
AH115
Watt, High Gain HBT Amplifier
Preliminary Data Sheet
Outline Drawing
Land Pattern
Product Marking
The component will be marked with an “AH115”
designator with a four- or five-digit alphanumeric lot
code on the top surface of the package. Tape and reel
specifications for this part is located on the website in
the “Application Notes” section.
ESD / MSL Information
ESD Classification:
Class 1B
Value:
Passes at 1000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
MSL Rating:
Level 2
Standard:
JEDEC Standard J-STD-020A
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink.
Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC
board in the region where the board contacts the
heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7.
All dimensions are in millimeters (inches). Angles
are in degrees.
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