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参数资料
型号： AM29DL162DB90PCI
厂商： ADVANCED MICRO DEVICES INC
元件分类： PROM
英文描述： 1M X 16 FLASH 3V PROM, 90 ns, PBGA64
封装： 13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64
文件页数： 23/56页
文件大小： 1752K
代理商： AM29DL162DB90PCI
February 14, 2003
Am29DL16xD
3
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 6
Special Package Handling Instructions .......................................... 8
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Ordering Information . . . . . . . . . . . . . . . . . . . . . . 10
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 11
Table 1. Am29DL16xD Device Bus Operations ....................................11
Word/Byte Configuration .............................................................. 11
Requirements for Reading Array Data ......................................... 11
Writing Commands/Command Sequences .................................. 12
Accelerated Program Operation ............................................... 12
Autoselect Functions ................................................................. 12
Simultaneous Read/Write Operations with Zero Latency ............ 12
Standby Mode .............................................................................. 12
Automatic Sleep Mode ................................................................. 12
RESET#: Hardware Reset Pin .....................................................13
Output Disable Mode ................................................................... 13
Table 2. Am29DL16xD Device Bank Divisions .....................................13
Table 3. Sector Addresses for Top Boot Sector Devices ......................14
Table 4. SecSi
Sector Addresses for Top Boot Devices .................. 14
Table 5. Sector Addresses for Bottom Boot Sector Devices .................15
Table 6. SecSi
Addresses for Bottom Boot Devices ........................ 15
Autoselect Mode .......................................................................... 16
Table 7. Am29DL16xD Autoselect Codes, (High Voltage Method) ......16
Sector/Sector Block Protection and Unprotection ........................ 17
Table 8. Top Boot Sector/Sector Block Addresses
for Protection/Unprotection ...................................................................17
Table 9. Bottom Boot Sector/Sector Block Addresses
for Protection/Unprotection ...................................................................17
Write Protect (WP#) ..................................................................... 18
Temporary Sector/Sector Block Unprotect ................................... 18
Figure 1. Temporary Sector Unprotect Operation................................. 18
Figure 2. In-System Sector/Sector Block Protection and
Unprotection Algorithms........................................................................ 19
SecSi
(Secured Silicon) Sector Flash Memory Region ............20
Factory Locked: SecSi Sector Programmed and Protected At the
Factory ...................................................................................... 20
Customer Lockable: SecSi Sector NOT Programmed or
Protected At the Factory ........................................................... 20
Hardware Data Protection ............................................................ 20
Low VCC Write Inhibit ............................................................... 21
Write Pulse “Glitch” Protection ..................................................21
Logical Inhibit ............................................................................ 21
Power-Up Write Inhibit .............................................................. 21
Common Flash Memory Interface (CFI) . . . . . . . 21
Table 10. CFI Query Identification String .............................................. 21
Table 11. System Interface String......................................................... 22
Table 12. Device Geometry Definition .................................................. 22
Table 13. Primary Vendor-Specific Extended Query ............................ 23
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 24
Reading Array Data ...................................................................... 24
Reset Command .......................................................................... 24
Autoselect Command Sequence ..................................................24
Enter SecSi
Sector/Exit SecSi Sector Command Sequence ....25
Byte/Word Program Command Sequence ................................... 25
Unlock Bypass Command Sequence ....................................... 25
Figure 3. Program Operation ................................................................ 26
Chip Erase Command Sequence ................................................. 26
Sector Erase Command Sequence .............................................. 26
Erase Suspend/Erase Resume Commands ................................ 27
Figure 4. Erase Operation .................................................................... 27
Command Definitions ................................................................... 28
Table 14. Am29DL16xD Command Definitions .................................... 28
Write Operation Status . . . . . . . . . . . . . . . . . . . . 29
DQ7: Data# Polling ...................................................................... 29
Figure 5. Data# Polling Algorithm ......................................................... 29
RY/BY#: Ready/Busy# ................................................................. 30
DQ6: Toggle Bit I .......................................................................... 30
Figure 6. Toggle Bit Algorithm .............................................................. 30
DQ2: Toggle Bit II ......................................................................... 31
Reading Toggle Bits DQ6/DQ2 .................................................... 31
DQ5: Exceeded Timing Limits ...................................................... 31
DQ3: Sector Erase Timer ............................................................. 31
Table 15. Write Operation Status ......................................................... 32
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 33
Figure 7. Maximum Negative Overshoot Waveform ............................. 33
Figure 8. Maximum Positive Overshoot Waveform ............................. 33
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 33
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 9. I
CC1 Current vs. Time (Showing Active and Automatic
Sleep Currents)..................................................................................... 35
Figure 10. Typical I
CC1 vs. Frequency................................................... 35
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 11. Test Setup .......................................................................... 36
Table 16. Test Specifications ................................................................ 36
Key To Switching Waveforms ...................................................... 36
Figure 12. Input Waveforms and Measurement Levels ........................ 36
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 13. Read Operation Timings...................................................... 37
Figure 14. Reset Timings...................................................................... 38
Word/Byte Configuration (BYTE#) ............................................... 39
Figure 15. BYTE# Timings for Read Operations .................................. 39
Figure 16. BYTE# Timings for Write Operations .................................. 39
Erase and Program Operations ................................................... 40
Figure 17. Program Operation Timings ................................................ 41
Figure 18. Accelerated Program Timing Diagram ................................ 41
Figure 19. Chip/Sector Erase Operation Timings ................................. 42
Figure 20. Back-to-back Read/Write Cycle Timings ............................. 43
Figure 21. Data# Polling Timings (During Embedded Algorithms) ....... 43
Figure 22. Toggle Bit Timings (During Embedded Algorithms) ............ 44
Figure 23. DQ2 vs. DQ6 ....................................................................... 44
Temporary Sector/Sector Block Unprotect ................................... 45
Figure 24. Temporary Sector/Sector Block Unprotect Timing Diagram 45
Figure 25. Sector/Sector Block Protect and Unprotect Timing Diagram 46
Alternate CE# Controlled Erase and Program Operations ........... 47
Figure 26. Alternate CE# Controlled Write (Erase/Program)
Operation Timings ................................................................................ 48
Erase And Programming Performance . . . . . . . 49
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 49
Package and Pin Capacitance . . . . . . . . . . . . . . . 49
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
FBC048—48-Ball Fine-Pitch Ball Grid Array
8 x 9 mm package ........................................................................ 50
LAA064—64-Ball Fortified Ball Grid Array,
13 x 11 mm package .................................................................... 51
TS 048—48-Pin Standard TSOP ................................................. 52
VBF048—48-Ball Very Thin Profile Fine-Pitch Ball Grid Array .... 53
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 54
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