参数资料
型号: APA1000-FGG1152
厂商: Microsemi SoC
文件页数: 120/178页
文件大小: 0K
描述: IC FPGA PROASIC+ 1M 1152-FBGA
标准包装: 24
系列: ProASICPLUS
RAM 位总计: 202752
输入/输出数: 712
门数: 1000000
电源电压: 2.3 V ~ 2.7 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 1152-BGA
供应商设备封装: 1152-FPBGA(35x35)
ProASICPLUS Flash Family FPGAs
2- 36
v5.9
Table 2-23 DC Electrical Specifications (VDDP = 3.3 V ±0.3 V and VDD = 2.5 V ±0.2 V)
Applies to Commercial and Industrial Temperature Only
Symbol
Parameter
Conditions
Commercial/Industrial1
Units
Min.
Typ.
Max.
VOH
Output High Voltage
3.3 V I/O, High Drive (OB33P)
3.3 V I/O, Low Drive (OB33L)
IOH = –14 mA
IOH = –24 mA
IOH = –6 mA
IOH = –12 mA
0.9
V
DDP
2.4
0.9
V
DDP
2.4
V
VOL
Output Low Voltage
3.3 V I/O, High Drive (OB33P)
3.3 V I/O, Low Drive (OB33L)
IOL = 15 mA
IOL = 20 mA
IOL = 28 mA
IOL = 7 mA
IOL = 10 mA
IOL = 15 mA
0.1VDDP
0.4
0.7
0.1VDDP
0.4
0.7
V
VIH
2
Input High Voltage
3.3 V Schmitt Trigger Inputs
3.3 V LVTTL/LVCMOS
2.5 V Mode
1.6
2
1.7
VDDP + 0.3
V
VIL
3
Input Low Voltage
3.3 V Schmitt Trigger Inputs
3.3 V LVTTL/LVCMOS
2.5 V Mode
–0.3
0.8
0.7
V
RWEAKPULLUP Weak
Pull-up
Resistance
(IOB33U)
VIN 1.5 V
7
43
k
Ω
RWEAKPULLUP Weak
Pull-up
Resistance
(IOB25U)
VIN 1.5 V
7
43
k
Ω
IIN
Input Current
with pull up (VIN = GND)
–300
–40
A
without pull up (VIN = GND or VDD)
–10
10
A
IDDQ
Quiescent Supply Current
(standby)
Commercial
VIN = GND
4 or V
DD
Std.
5.0
15
mA
IDDQ
Quiescent Supply Current
(standby)
Industrial
VIN = GND
4 or V
DD
Std.
5.0
20
mA
IDDQ
Quiescent Supply Current
(standby)
Military
VIN = GND
4 or V
DD
Std.
5.0
25
mA
Notes:
1. All process conditions. Commercial/Industrial: Junction Temperature: –40 to +110°C.
2. During transitions, the input signal may overshoot to VDDP +1.0 V for a limited time of no larger than 10% of the duty cycle.
3. During transitions, the input signal may undershoot to –1.0 V for a limited time of no larger than 10% of the duty cycle.
4. No pull-up resistor required.
相关PDF资料
PDF描述
APA1000-FG1152 IC FPGA PROASIC+ 1M 1152-FBGA
93AA46CXT-I/SN IC EEPROM 1KBIT 3MHZ 8SOIC
EP2AGX125EF29I5N IC ARRIA II GX FPGA 125K 780FBGA
EP1S30F1020C6 IC STRATIX FPGA 30K LE 1020-FBGA
A14100A-BG313C IC FPGA 10K GATES 313-BGA
相关代理商/技术参数
参数描述
APA1000-FGG1152I 功能描述:IC FPGA PROASIC+ 1M 1152-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
APA1000-FGG896 功能描述:IC FPGA PROASIC+ 1M 896-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
APA1000-FGG896A 功能描述:IC FPGA PROASIC+ 1M 896-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
APA1000-FGG896I 功能描述:IC FPGA PROASIC+ 1M 896-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
APA1000-FGG896M 制造商:Microsemi Corporation 功能描述:FPGA ProASICPLUS Family 1M Gates 180MHz 0.22um Technology 2.5V 896-Pin FBGA 制造商:Microsemi Corporation 功能描述:FPGA PROASICPLUS 1M GATES 180MHZ 0.22UM 2.5V 896FBGA - Trays