收藏本站
参数资料
型号： APA600-BG456I
厂商： Microsemi SoC
文件页数： 106/178页
文件大小： 0K
描述： IC FPGA PROASIC+ 600K 456-PBGA
标准包装： 24
系列： ProASICPLUS
RAM 位总计： 129024
输入/输出数： 356
门数： 600000
电源电压： 2.3 V ~ 2.7 V
安装类型： 表面贴装
工作温度： -40°C ~ 85°C
封装/外壳： 456-BBGA
供应商设备封装： 456-PBGA（35x35）
ProASICPLUS Flash Family FPGAs
v5.9
2-23
Note: Each RAM block contains a multiplexer (called DMUX) for each output signal, increasing design efficiency. These DMUX cells do not
consume any core logic tiles and connect directly to high-speed routing resources between the RAM blocks. They are used when
RAM blocks are cascaded and are automatically inserted by the software tools.
Figure 2-19 Basic FIFO Block Diagrams
Table 2-15 Memory Block FIFO Interface Signals
FIFO Signal
Bits
In/Out
Description
WCLKS
1
In
Write clock used for synchronization on write side
RCLKS
1
In
Read clock used for synchronization on read side
LEVEL <0:7>
8
In
Direct configuration implements static flag logic
RBLKB
1
In
Read block select (active Low)
RDB
1
In
Read pulse (active Low)
RESET
1
In
Reset for FIFO pointers (active Low)
WBLKB
1
In
Write block select (active Low)
DI<0:8>
9
In
Input data bits <0:8>, <8> will be generated parity if PARGEN is true
WRB
1
In
Write pulse (active Low)
FULL, EMPTY
2
Out
FIFO flags. FULL prevents write and EMPTY prevents read
EQTH, GEQTH
2
Out
EQTH is true when the FIFO holds the number of words specified by the LEVEL signal.
GEQTH is true when the FIFO holds (LEVEL) words or more
DO<0:8>
9
Out
Output data bits <0:8>. <8> will be parity output if PARGEN is true.
RPE
1
Out
Read parity error (active High)
WPE
1
Out
Write parity error (active High)
LGDEP <0:2>
3
In
Configures DEPTH of the FIFO to 2 (LGDEP+1)
PARODD
1
In
Parity generation/detect – Even when Low, odd when High
FIFO
(256x9)
LEVEL<0:7>
DO <0:8>
DI<0:8>
WRB
RDB
WBLKB
RBLKB
RPE
PARODD
WPE
LGDEP<0:2>
FULL
EMPTY
EQTH
GEQTH
WCLKS
RCLKS
RESET
RPE
WPE
FULL
EMPTY
EQTH
GEQTH
DO <0:8>
RPE
WPE
FULL
EMPTY
EQTH
GEQTH
DI <0:8>
DO <0:8>
LEVEL <0:7>
WRB
RDB
WBLKB
RBLKB
RPE
PARODD
WPE
LGDEP<0:2>
DI <0:8>
LEVEL <0:7>
WRB
RDB
WBLKB
RBLKB
PARODD
LGDEP<0:2>
FULL
EMPTY
EQTH
GEQTH
RCLKS
RESET
LEVEL<0:7>
DI<0:8>
WRB
RDB
WBLKB
RBLKB
PARODD
LGDEP<0:2>
WCLKS
DO <0:8>
FIFO
(256x9)
FIFO
(256x9)
FIFO
(256x9)
Sync Write
and
Sync Read
Ports
Sync Write
and
Async Read
Ports
Async Write
and
Sync Read
Ports
Async Write
and
Async Read
Ports
相关PDF资料
PDF描述
APA600-BGG456I IC FPGA PROASIC+ 600K 456-PBGA
RMA50DRMD-S273 CONN EDGECARD 100POS .125 SQ WW
AX1000-2FG676 IC FPGA AXCELERATOR 1M 676-FBGA
AX1000-2FGG676 IC FPGA AXCELERATOR 1M 676-FBGA
ASM43DSEI-S13 CONN EDGECARD 86POS .156 EXTEND
相关代理商/技术参数
参数描述
APA600-BG456M 制造商:Microsemi Corporation 功能描述:FPGA ProASICPLUS Family 600K Gates 180MHz 0.22um Technology 2.5V 456-Pin BGA 制造商:Microsemi Corporation 功能描述:FPGA PROASICPLUS 600K GATES 180MHZ 0.22UM 2.5V 456BGA - Trays
APA600-BGB 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA600-BGES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA600-BGG456 功能描述:IC FPGA PROASIC+ 600K 456-PBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA（23x23）
APA600-BGG456I 功能描述:IC FPGA PROASIC+ 600K 456-PBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA（23x23）
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*