收藏本站
参数资料
型号： APA600-BG456I
厂商： Microsemi SoC
文件页数： 112/178页
文件大小： 0K
描述： IC FPGA PROASIC+ 600K 456-PBGA
标准包装： 24
系列： ProASICPLUS
RAM 位总计： 129024
输入/输出数： 356
门数： 600000
电源电压： 2.3 V ~ 2.7 V
安装类型： 表面贴装
工作温度： -40°C ~ 85°C
封装/外壳： 456-BBGA
供应商设备封装： 456-PBGA（35x35）
ProASICPLUS Flash Family FPGAs
v5.9
2-29
Logic-Tile Contribution—Plogic
Plogic, the logic-tile component of AC power dissipation, is given by
Plogic = P3 * mc * Fs
where:
I/O Output Buffer Contribution—Poutputs
Poutputs, the I/O component of AC power dissipation, is given by
Poutputs = (P4 + (Cload * VDDP
2)) * p * Fp
where:
I/O Input Buffer's Buffer Contribution—Pinputs
The input’s component of AC power dissipation is given by
Pinputs = P8 * q * Fq
where:
PLL Contribution—Ppll
Ppll = P9 * Npll
where:
RAM Contribution—Pmemory
Finally, Pmemory, the memory component of AC power consumption, is given by
Pmemory = P6 * Nmemory * Fmemory * Ememory
where:
P3
=
1.4
μW/MHz is the average power consumption of a logic tile per MHz of its output toggling rate. The
maximum output toggling rate is Fs/2.
mc
=
the number of logic tiles switching during each Fs cycle
Fs
=
the clock frequency
P4
=
326
μW/MHz is the intrinsic power consumption of an output pad normalized per MHz of the output
frequency. This is the total I/O current VDDP.
Cload =
the output load
p
=
the number of outputs
Fp
=
the average output frequency
P8
=
29
μW/MHz is the intrinsic power consumption of an input pad normalized per MHz of the input
frequency.
q
=
the number of inputs
Fq
=
the average input frequency
P9
=
7.5 mW. This value has been estimated at maximum PLL clock frequency.
NPll
=
number of PLLs used
P6
=
175 W/MHz is the average power consumption of a memory block per MHz of the clock
Nmemory
=
the number of RAM/FIFO blocks
(1 block = 256 words * 9 bits)
Fmemory
=
the clock frequency of the memory
Ememory
=
the average number of active blocks divided by the total number of blocks (N) of the memory.
Typical values for Ememory would be 1/4 for a 1k x 8,9,16, 32 memory and 1/16 for a 4kx8,
9, 16, and 32 memory configuration
In addition, an application-dependent component to Ememory can be considered. For
example, for a 1kx8 memory configuration using only 1 cycle out of 2, Ememory = 1/4*1/2 = 1/8
相关PDF资料
PDF描述
APA600-BGG456I IC FPGA PROASIC+ 600K 456-PBGA
RMA50DRMD-S273 CONN EDGECARD 100POS .125 SQ WW
AX1000-2FG676 IC FPGA AXCELERATOR 1M 676-FBGA
AX1000-2FGG676 IC FPGA AXCELERATOR 1M 676-FBGA
ASM43DSEI-S13 CONN EDGECARD 86POS .156 EXTEND
相关代理商/技术参数
参数描述
APA600-BG456M 制造商:Microsemi Corporation 功能描述:FPGA ProASICPLUS Family 600K Gates 180MHz 0.22um Technology 2.5V 456-Pin BGA 制造商:Microsemi Corporation 功能描述:FPGA PROASICPLUS 600K GATES 180MHZ 0.22UM 2.5V 456BGA - Trays
APA600-BGB 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA600-BGES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA600-BGG456 功能描述:IC FPGA PROASIC+ 600K 456-PBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA（23x23）
APA600-BGG456I 功能描述:IC FPGA PROASIC+ 600K 456-PBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA（23x23）
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*