参数资料
型号: APA600-FG256I
厂商: Microsemi SoC
文件页数: 135/178页
文件大小: 0K
描述: IC FPGA PROASIC+ 600K 256-FBGA
标准包装: 90
系列: ProASICPLUS
RAM 位总计: 129024
输入/输出数: 186
门数: 600000
电源电压: 2.3 V ~ 2.7 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 256-LBGA
供应商设备封装: 256-FPBGA(17x17)
ProASICPLUS Flash Family FPGAs
1- 2
v5.9
ProASICPLUS Architecture
The
proprietary
ProASICPLUS
architecture
provides
granularity comparable to gate arrays.
The ProASICPLUS device core consists of a Sea-of-Tiles
(Figure 1-1). Each tile can be configured as a three-input
logic function (e.g., NAND gate, D-Flip-Flop, etc.) by
programming
the
appropriate
flash
switch
Tiles and larger functions are connected with any of the
four levels of routing hierarchy. Flash switches are
distributed
throughout
the
device
to
provide
nonvolatile, reconfigurable interconnect programming.
Flash switches are programmed to connect signal lines to
the appropriate logic cell inputs and outputs. Dedicated
high-performance lines are connected as needed for fast,
low-skew global signal distribution throughout the core.
Maximum core utilization is possible for virtually any
design.
ProASICPLUS devices also contain embedded, two-port
SRAM blocks with built-in FIFO/RAM control logic.
Programming
options
include
synchronous
or
asynchronous operation, two-port RAM configurations,
user-defined depth and width, and parity generation or
checking.
Refer
to
the
for
more
information.
Figure 1-1 The ProASICPLUS Device Architecture
Figure 1-2 Flash Switch
256x9 Two-Port SRAM
or FIFO Block
Logic Tile
256x9 Two Port SRAM
or FIFO Block
RAM Block
I/Os
Sensing
Switching
Switch In
Switch Out
Word
Floating Gate
相关PDF资料
PDF描述
ABB90DHLN CONN EDGECARD 180PS .050 DIP SLD
A42MX36-1PQG208 IC FPGA MX SGL CHIP 54K 208-PQFP
ACB90DHLD CONN EDGECARD 180PS .050 DIP SLD
A42MX36-1PQ208 IC FPGA MX SGL CHIP 54K 208-PQFP
ABB90DHLD CONN EDGECARD 180PS .050 DIP SLD
相关代理商/技术参数
参数描述
APA600-FG256IX95 制造商:Microsemi Corporation 功能描述:
APA600-FG256M 制造商:Microsemi Corporation 功能描述:FPGA ProASICPLUS Family 600K Gates 180MHz 0.22um Technology 2.5V 256-Pin FBGA 制造商:Microsemi Corporation 功能描述:FPGA PROASICPLUS 600K GATES 180MHZ 0.22UM 2.5V 256FBGA - Trays 制造商:Microsemi SOC Products Group 功能描述:FPGA PROASICPLUS 600K GATES 180MHZ 0.22UM 2.5V 256FBGA - Trays
APA600-FG484 功能描述:IC FPGA PROASIC+ 600K 484-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
APA600-FG484A 功能描述:IC FPGA PROASIC+ 600K 484-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
APA600-FG484I 功能描述:IC FPGA PROASIC+ 600K 484-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)