参数资料
型号: APA750-FG676
厂商: Microsemi SoC
文件页数: 135/178页
文件大小: 0K
描述: IC FPGA PROASIC+ 750K 676-FBGA
标准包装: 40
系列: ProASICPLUS
RAM 位总计: 147456
输入/输出数: 454
门数: 750000
电源电压: 2.3 V ~ 2.7 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 676-BGA
供应商设备封装: 676-FBGA(27x27)
ProASICPLUS Flash Family FPGAs
1- 2
v5.9
ProASICPLUS Architecture
The
proprietary
ProASICPLUS
architecture
provides
granularity comparable to gate arrays.
The ProASICPLUS device core consists of a Sea-of-Tiles
(Figure 1-1). Each tile can be configured as a three-input
logic function (e.g., NAND gate, D-Flip-Flop, etc.) by
programming
the
appropriate
flash
switch
Tiles and larger functions are connected with any of the
four levels of routing hierarchy. Flash switches are
distributed
throughout
the
device
to
provide
nonvolatile, reconfigurable interconnect programming.
Flash switches are programmed to connect signal lines to
the appropriate logic cell inputs and outputs. Dedicated
high-performance lines are connected as needed for fast,
low-skew global signal distribution throughout the core.
Maximum core utilization is possible for virtually any
design.
ProASICPLUS devices also contain embedded, two-port
SRAM blocks with built-in FIFO/RAM control logic.
Programming
options
include
synchronous
or
asynchronous operation, two-port RAM configurations,
user-defined depth and width, and parity generation or
checking.
Refer
to
the
for
more
information.
Figure 1-1 The ProASICPLUS Device Architecture
Figure 1-2 Flash Switch
256x9 Two-Port SRAM
or FIFO Block
Logic Tile
256x9 Two Port SRAM
or FIFO Block
RAM Block
I/Os
Sensing
Switching
Switch In
Switch Out
Word
Floating Gate
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APA750-FG676I 功能描述:IC FPGA PROASIC+ 750K 676-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
APA750-FG896 功能描述:IC FPGA PROASIC+ 750K 896-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
APA750-FG896A 功能描述:IC FPGA PROASIC+ 750K 896-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
APA750-FG896I 功能描述:IC FPGA PROASIC+ 750K 896-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
APA750-FGB 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs