参数资料
型号: APTGV50H120BTPG
厂商: MICROSEMI POWER PRODUCTS GROUP
元件分类: IGBT 晶体管
英文描述: 75 A, 1200 V, N-CHANNEL IGBT
封装: ROHS COMPLIANT, SP6-P, MODULE-21
文件页数: 1/13页
文件大小: 426K
代理商: APTGV50H120BTPG
APTGV50H120BTPG
A
P
TG
V50H
120
BTPG
R
ev
0
Se
pte
m
be
r,
2007
www.microsemi.com
1-13
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
G3
Q3
OUT2
CR3
OUT1
E3
Q4
G1
Q1
VBUS1
E4
E1
Q2
Q5
CR5
K
E2
NTC
NTC1
E5
E
0/VBUS1
G4
CR4
C
0/VBUS2
NTC2
VBUS2
CR1
CR2
CR5B
G2
G5
Full bridge top switches : Trench + Field Stop IGBT
Full bridge bottom switches : FAST NPT IGBT
Q5 boost chopper : FAST NPT IGBT
G3
E4
G4
E3
G5
VBUS 2
VBUS 1
G1
0/VBUS 1
0/VBUS 2
E1
K
OUT2
OUT 1
E2
G2
E5
E
C
NT
C
1
NT
C
2
Trench & Field Stop IGBT Q1, Q3:
VCES = 1200V ; IC = 50A @ Tc = 80°C
Fast NPT IGBT Q2, Q4:
VCES = 1200V ; IC = 50A @ Tc = 80°C
Fast NPT IGBT Q5:
VCES = 1200V ; IC = 100A @ Tc = 80°C
Application
Solar converter
Features
Q2, Q4, Q5 (FAST Non Punch Through (NPT) IGBT)
- Switching frequency up to 100 kHz
- RBSOA & SCSOA rated
- Low tail current
Q1, Q3 (Trench & Field Stop IGBT)
- Low voltage drop
- Switching frequency up to 20 kHz
- RBSOA & SCSOA rated
- Low tail current
Kelvin emitter for easy drive
Very low stray inductance
High level of integration
Internal thermistor for temperature monitoring
Benefits
Optimized conduction & switching losses
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Solderable terminals both for power and signal
for easy PCB mounting
Low profile
Easy paralleling due to positive TC of VCEsat
RoHS Compliant
Boost chopper + full bridge
NPT & Trench + Field Stop IGBT
Power module
相关PDF资料
PDF描述
AR0001 MOBILE STATION ANTENNA
AR0001 MOBILE STATION ANTENNA
ARA2000S23TR RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER
AT30TS750-XM8-T DIGITAL TEMP SENSOR-SERIAL, 12BIT(s), 3Cel, SQUARE, SURFACE MOUNT
AT30TS750-MA8-T DIGITAL TEMP SENSOR-SERIAL, 12BIT(s), 3Cel, RECTANGULAR, SURFACE MOUNT
相关代理商/技术参数
参数描述
APTGV50H120T3G 功能描述:IGBT NPT BST CHOP FULL BRDG SP3 RoHS:是 类别:半导体模块 >> IGBT 系列:NPT & Trench + Field Stop® 标准包装:10 系列:GenX3™ IGBT 类型:PT 配置:单一 电压 - 集电极发射极击穿(最大):600V Vge, Ic时的最大Vce(开):1.4V @ 15V,100A 电流 - 集电极 (Ic)(最大):430A 电流 - 集电极截止(最大):100µA Vce 时的输入电容 (Cies):31nF @ 25V 功率 - 最大:1000W 输入:标准 NTC 热敏电阻:无 安装类型:底座安装 封装/外壳:SOT-227-4,miniBLOC 供应商设备封装:SOT-227B
APTGV50H60BG 功能描述:IGBT NPT BST CHOP FULL BRDG SP4 RoHS:是 类别:半导体模块 >> IGBT 系列:- 标准包装:10 系列:GenX3™ IGBT 类型:PT 配置:单一 电压 - 集电极发射极击穿(最大):600V Vge, Ic时的最大Vce(开):1.4V @ 15V,100A 电流 - 集电极 (Ic)(最大):430A 电流 - 集电极截止(最大):100µA Vce 时的输入电容 (Cies):31nF @ 25V 功率 - 最大:1000W 输入:标准 NTC 热敏电阻:无 安装类型:底座安装 封装/外壳:SOT-227-4,miniBLOC 供应商设备封装:SOT-227B
APTGV50H60BT3G 制造商:Microsemi Corporation 功能描述:POWER MODULE - IGBT - Bulk 制造商:Microsemi Corporation 功能描述:MOD IGBT NPT 600V SP3 制造商:Microsemi Corporation 功能描述:POWER MOSFET TRANSISTOR
APTGV50H60T3G 功能描述:IGBT NPT BST CHOP FULL BRDG SP3 RoHS:是 类别:半导体模块 >> IGBT 系列:- 标准包装:10 系列:GenX3™ IGBT 类型:PT 配置:单一 电压 - 集电极发射极击穿(最大):600V Vge, Ic时的最大Vce(开):1.4V @ 15V,100A 电流 - 集电极 (Ic)(最大):430A 电流 - 集电极截止(最大):100µA Vce 时的输入电容 (Cies):31nF @ 25V 功率 - 最大:1000W 输入:标准 NTC 热敏电阻:无 安装类型:底座安装 封装/外壳:SOT-227-4,miniBLOC 供应商设备封装:SOT-227B
APTGV75H60T3G 功能描述:IGBT NPT BST CHOP FULL BRDG SP3 RoHS:是 类别:半导体模块 >> IGBT 系列:- 标准包装:10 系列:GenX3™ IGBT 类型:PT 配置:单一 电压 - 集电极发射极击穿(最大):600V Vge, Ic时的最大Vce(开):1.4V @ 15V,100A 电流 - 集电极 (Ic)(最大):430A 电流 - 集电极截止(最大):100µA Vce 时的输入电容 (Cies):31nF @ 25V 功率 - 最大:1000W 输入:标准 NTC 热敏电阻:无 安装类型:底座安装 封装/外壳:SOT-227-4,miniBLOC 供应商设备封装:SOT-227B