参数资料
型号: AT24C01B-TH-T
厂商: Atmel
文件页数: 22/25页
文件大小: 0K
描述: IC EEPROM 1KBIT 1MHZ 8TSSOP
标准包装: 5,000
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 1K (128 x 8)
速度: 400kHz,1MHz
接口: I²C,2 线串口
电源电压: 1.8 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 8-TSSOP
包装: 带卷 (TR)
12. 5TS1 – SOT23
e1
L
E1
5
4
E
C
C
L1
Seating
1
2
Top View
b
3
A2
A
End View
Plane
e
D
Side View
A1
COMMON DIMENSIONS
(Unit of Measure = mm)
NOTES: 1. This drawing is for general information only. Refer to JEDEC Drawing
MO-193, Variation AB, for additional information.
2. Dimension D does not include mold flash, protrusions, or gate burrs.
Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per end.
Dimension E1 does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.15 mm per side.
3. The package top may be smaller than the package bottom. Dimensions
D and E1 are determined at the outermost extremes of the plastic body
exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but
including any mismatch between the top and bottom of the plastic body.
4. These dimensions apply to the flat section of the lead between 0.08 mm
and 0.15 mm from the lead tip.
SYMBOL
A
A1
A2
c
D
E
E1
MIN
0.00
0.70
0.08
NOM
0.90
2.90 BSC
2.80 BSC
1.60 BSC
MAX
1.10
0.10
1.00
0.20
NOTE
4
2, 3
2, 3
2, 3
5. Dimension "b" does not include Dambar protrusion. Allowable Dambar
protrusion shall be 0.08 mm total in excess of the "b" dimension at
maximum material condition. The Dambar cannot be located on the lower
radius of the foot. Minimum space between protrusion and an adjacent lead
L1
e
e1
0.60 REF
0.95 BSC
1.90 BSC
shall not be less than 0.07 mm.
b
0.30
0.50
4, 5
6/25/03
1150 E. Cheyenne Mtn. Blvd.
TITLE
5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink
DRAWING NO.
REV.
R
Colorado Springs, CO 80906
Small Outline Package (SHRINK SOT)
PO5TS1
A
22
AT24C01B
5156E–SEEPR–10/08
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