参数资料
型号: AT25256W-10SI-2.7
厂商: Atmel
文件页数: 21/22页
文件大小: 0K
描述: IC EEPROM 256KBIT 3MHZ 8SOIC
标准包装: 94
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 256K (32K x 8)
速度: 2.1MHz,3MHz
接口: SPI 3 线串行
电源电压: 2.7 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.209",5.30mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
AT25128/256
20A2 – TSSOP
b
L
L1
E
E1
e
Top View
End View
COMMON DIMEN S ION S
(Unit of Me asu re = mm)
S YMBOL
D
MIN
6.40
NOM
6.50
MAX
6.60
NOTE
2, 5
A
D
A2
E
E1
4. 3 0
6.40 B S C
4.40
4.50
3 , 5
A
A2
0. 8 0
1.00
1.20
1.05
b
0.19
0. 3 0
4
e
0.65 B S C
S ide View
L
0.45
0.60
0.75
L1
1.00 REF
Note s :
1. Thi s dr a wing i s for gener a l inform a tion only. Ple as e refer to JEDEC Dr a wing MO-15 3 , V a ri a tion AC, for a ddition a l
inform a tion.
2. Dimen s ion D doe s not incl u de mold Fl as h, protr us ion s or g a te bu rr s . Mold Fl as h, protr us ion s a nd g a te bu rr s s h a ll
not exceed 0.15 mm (0.006 in) per s ide.
3 . Dimen s ion E1 doe s not incl u de inter-le a d Fl as h or protr us ion s . Inter-le a d Fl as h a nd protr us ion s s h a ll not exceed
0.25 mm (0.010 in) per s ide.
4. Dimen s ion b doe s not incl u de D a m ba r protr us ion. Allow ab le D a m ba r protr us ion s h a ll b e 0.0 8 mm tot a l in exce ss
of the b dimen s ion a t m a xim u m m a teri a l condition. D a m ba r c a nnot b e loc a ted on the lower r a di us of the foot.
Minim u m s p a ce b etween protr us ion a nd a dj a cent le a d i s 0.07 mm.
5. Dimen s ion D a nd E1 to b e determined a t D a t u m Pl a ne H.
6/ 3 /02
TITLE
DRAWING NO.
REV.
R
2 3 25 Orch a rd P a rkw a y
Sa n Jo s e, CA 951 3 1
20A2 , 20-le a d (4.4 x 6.5 mm Body), 0.65 pitch,
Thin S hrink S m a ll O u tline P a ck a ge (T SS OP)
20A2
C
21
0872O–SEEPR–03/05
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