参数资料
型号: AT88SA100S-SH-T
厂商: Atmel
文件页数: 20/23页
文件大小: 0K
描述: IC BATTERY AUTHENTICATION 8SOIC
产品培训模块: CryptoAuthentication™ Introduction
标准包装: 1
系列: CryptoAuthentication™
功能: 电池验证
电源电压: 2.7 V ~ 5.25 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 标准包装
其它名称: AT88SA100S-SH-TDKR

8.
Package Drawings
3TS1 – 3-lead Shrink SOT
GND
3
E1
Signal
SDA
SEATING
1
e1
Top View
b
2
V CC
A2
E
A
CL
End View
PLANE
e
D
Side View
A1
Notes:
1. Dimension D does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.25mm per
COMMON DIMENSIONS
(Unit of Measure = mm)
end. Dimension E1 does not include interlead flash or protrusion.
Interlead flash or protrusion shall not exceed 0.25mm per side.
2. The package top may be smaller than the package bottom.
Dimensions D and E1 are determined at the outermost extremes of
the plastic body exclusive of mold flash, tie bar burrs, gate burrs and
interlead flash, but including any mismatch between the top and
bottom of the plastic body.
3. These dimensions apply to the flat section of the lead between 0.08
mm and 0.15mm from the lead tip.
SYMBOL
A
A1
A2
D
E
E1
MIN
0.89
0.01
0.88
2.80
2.10
1.20
NOM
-
-
-
2.90
-
1.30
MAX
1.12
0.10
1.02
3.04
2.64
1.40
NOTE
1,2
1,2
L1
0.54 REF
This drawing is for general information only. Refer to JEDEC Drawing
TO-236, Variation AB for additional information.
e1
b
0.30
1.90 BSC
-
0.50
3
12/11/09
TITLE
GPC
DRAWING NO.
REV.
Package Drawing Contact:
3TS1, 3-lead, 1.30mm Body, Plastic Thin
Shrink Small Outline Package (Shrink SOT)
TBG
3TS1
B
packagedrawings@atmel.com
20
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