参数资料
型号: BUF20820EVM
厂商: Texas Instruments
文件页数: 19/29页
文件大小: 0K
描述: EVAL MOUDLE FOR BUF20820
标准包装: 1
系列: *
BUF20820
SBOS330E DECEMBER 2005 REVISED OCTOBER 2008
www.ti.com
26
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
The thermal pad is electrically isolated from all terminals in the package.
Thermal
Pad
Figure 23. Views of Thermally-Enhanced DCP Package
For a given
qJA, the maximum power dissipation is shown
in Figure 24, and is calculated by Equation 3:
P
D
+
T
MAX
* T
A
q
JA
Where:
PD = maximum power dissipation (W)
TMAX = absolute maximum junction temperature (125
°C)
TA = free-ambient air temperature (
°C)
qJA = qJC + qCA
qJC = thermal coefficient from junction-to-case (°C/W)
qCA = thermal coefficient from case-to-ambient air (°C/W)
6
5
4
3
2
1
0
M
a
x
imum
P
ow
er
D
is
s
ipat
io
n
(W
)
40
20
0
100
40
60
80
20
T
A, FreeAir Temperature (_ C)
Figure 24. Maximum Power Dissipation vs
Free-Air Temperature
(with PowerPAD soldered down)
(3)
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