参数资料
型号: BX80552651
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 3400 MHz, MICROPROCESSOR, PBGA775
封装: FLIP CHIP, LGA-775
文件页数: 101/108页
文件大小: 3283K
代理商: BX80552651
94
Datasheet
Boxed Processor Specifications
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The
physical space requirements and dimensions for the boxed processor with assembled fan heatsink
are shown in Figure 7-2 (Side View), and Figure 7-3 (Top View). The airspace requirements for the
boxed processor fan heatsink must also be incorporated into new baseboard and system designs.
Airspace requirements are shown in Figure 7-7 and Figure 7-8. Note that some figures have
centerlines shown (marked with alphabetic designations) to clarify relative dimensioning.
NOTES:
1. The boxed Pentium 4 processor in the 775-land package cooling solution with clip is currently under
development and, at this time, is preliminary. The diagrams shown may not reflect the final product.
2. Diagram does not show the attached hardware for the clip design and is provided only as a mechanical
representation.
Figure 7-2. Space Requirements for the Boxed Processor (Side View; applies to all four side
views)
Figure 7-3. Space Requirements for the Boxed Processor (Top View)
Bd P
Sid Vi
95.0
[3.74]
10.0
[0.39]
25.0
[0.98]
81.3
[3.2]
95.0
[3.74]
95.0
[3.74]
相关PDF资料
PDF描述
BX80552651T 32-BIT, 3400 MHz, MICROPROCESSOR, PBGA775
BX80552661 32-BIT, 3600 MHz, MICROPROCESSOR, PBGA775
BX80552651T2 32-BIT, 3400 MHz, MICROPROCESSOR, PBGA775
BX80552641T 32-BIT, 3200 MHz, MICROPROCESSOR, PBGA775
BX80552641T2 32-BIT, 3200 MHz, MICROPROCESSOR, PBGA775
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