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参数资料
| 型号： | BX80552651 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 3400 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 13/108页 |
| 文件大小： | 3283K |
| 代理商： | BX80552651 |
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14
Datasheet
Introduction
The processor includes an address bus powerdown capability that removes power from the address
and data signals when the FSB is not in use. This feature is always enabled on the processor.
Enhanced Intel SpeedStep technology allows trade-offs to be made between performance and
power consumptions. This may lower average power consumption (in conjunction with OS
support).
1.1
Terminology
A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in the active
state when driven to a low level. For example, when RESET# is low, a reset has been requested.
Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of signals where
the name does not imply an active state but describes part of a binary sequence (such as address or
data), the ‘#’ symbol implies that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a
hex ‘A’, and D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).
Front Side Bus” refers to the interface between the processor and system core logic (a.k.a. the
chipset components). The FSB is a multiprocessing interface to processors, memory, and I/O.
1.1.1
Processor Packaging Terminology
Commonly used terms are explained here for clarification:
Intel Pentium 4 processor on 65 nm process in the 775-land package — Processor in the
FC-LGA6 package with a 2 MB L2 cache.
Processor — For this document, the term processor is the generic form of the Intel Pentium
4 processor 6x1 sequence on 65 nm process in the 775-land package.
Keep-out zone — The area on or near the processor that system design can not utilize.
Intel 945G/945GZ/945P/945PL Express chipsets — Chipset that supports DDR and DDR2
memory technology for the Pentium 4 processor.
Processor core — Processor core die with integrated L2 cache.
LGA775 socket — The Pentium 4 processor mates with the system board through a surface
mount, 775-land, LGA socket.
Integrated heat spreader (IHS) —A component of the processor package used to enhance
the thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
Retention mechanism (RM) — Since the LGA775 socket does not include any mechanical
features for heatsink attach, a retention mechanism is required. Component thermal solutions
should attach to the processor via a retention mechanism that is independent of the socket.
FSB (Front Side Bus) — The electrical interface that connects the processor to the chipset.
Also referred to as the processor system bus or the system bus. All memory and I/O
transactions as well as interrupt messages pass between the processor and chipset over the
FSB.
Storage conditions — Refers to a non-operational state. The processor may be installed in a
platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air.
Under these conditions, processor lands should not be connected to any supply voltages, have
any I/Os biased, or receive any clocks. Upon exposure to “free air”(i.e., unsealed packaging or
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BX80552651T2 | 制造商:Intel 功能描述:P4 651 3.4GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
| BX80552651T2 S L94W | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? 4 Processor 651 65nm 3.4GHz 775-Pin FCLGA6 |
| BX80552651T2 S L9KE | 制造商:Intel 功能描述:MPU Pentium |
| BX80552661T2 | 制造商:Intel 功能描述:P4 661 3.6GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
| BX80553915 S L9KB | 制造商:Intel 功能描述: |
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