参数资料
型号: COP8CCR9LVA8
厂商: National Semiconductor
文件页数: 8/111页
文件大小: 0K
描述: IC MCU EEPROM 8BIT 68-PLCC
标准包装: 18
系列: COP8™ 8C
核心处理器: COP8
芯体尺寸: 8-位
速度: 20MHz
连通性: Microwire/Plus(SPI),UART/USART
外围设备: 欠压检测/复位,POR,PWM,WDT
输入/输出数: 59
程序存储器容量: 32KB(32K x 8)
程序存储器类型: 闪存
RAM 容量: 1K x 8
电压 - 电源 (Vcc/Vdd): 2.7 V ~ 5.5 V
数据转换器: A/D 16x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 68-LCC(J 形引线)
包装: 管件
其它名称: *COP8CCR9LVA8
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
COP8CBR9HVA8/NOPB
ACTIVE
PLCC
FN
44
25
Green (RoHS
& no Sb/Br)
SN
Level-2A-245C-4
WEEK
-40 to 85
COP8CBR9HVA8
COP8CBR9IMT8/NOPB
ACTIVE
TSSOP
DGG
48
38
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 85
COP8CBR9IMT8
COP8CCR9HVA8/NOPB
ACTIVE
PLCC
FN
44
25
Green (RoHS
& no Sb/Br)
SN
Level-3-245C-168 HR
-40 to 125
COP8CCR9HVA8
COP8CCR9IMT7/NOPB
ACTIVE
TSSOP
DGG
48
38
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-2-260C-1 YEAR
-40 to 125
COP8CCR9IMT7
COP8CCR9IMT8/63SN
ACTIVE
TSSOP
DGG
48
1000
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-2-260C-1 YEAR
COP8CCR9IMT8
COP8CCR9IMT8/NOPB
ACTIVE
TSSOP
DGG
48
38
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-2-260C-1 YEAR
-40 to 125
COP8CCR9IMT8
COP8CCR9LVA7/63SN
ACTIVE
PLCC
FN
68
250
Green (RoHS
& no Sb/Br)
SN
Level-4-245C-72 HR
COP8CCR9LVA7
COP8CCR9LVA7/NOPB
ACTIVE
PLCC
FN
68
18
Green (RoHS
& no Sb/Br)
SN
Level-2A-245C-4
WEEK
-40 to 125
COP8CCR9LVA7
COP8CDR9HVA8/NOPB
ACTIVE
PLCC
FN
44
25
Green (RoHS
& no Sb/Br)
SN
Level-3-245C-168 HR
-40 to 85
COP8CDR9HVA8
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
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