参数资料
型号: CY39200V256-233MBC
厂商: Cypress Semiconductor Corp.
英文描述: CPLDs at FPGA Densities
中文描述: CPLD器件在FPGA的密度
文件页数: 38/86页
文件大小: 1235K
代理商: CY39200V256-233MBC
Delta39K ISR
CPLD Family
Document #: 38-03039 Rev. *H
Page 38 of 86
Delta39K Part Numbers (Ordering Information)
Device
39K30
Speed
(MHz)
233
Ordering Code
CY39030V208-233NTC
CY39030V256-233BBC
CY39030V256-233MBC
CY39030V208-125NTC
CY39030V256-125BBC
CY39030V256-125MBC
CY39030V208-125NTI
CY39030V256-125BBI
CY39030V208-83NTC
CY39030V256-83BBC
CY39030V256-83MBC
CY39030V208-83NTI
CY39030V256-83BBI
CY39050V208-233NTC
CY39050V256-233BBC
CY39050V388-233MGC
CY39050V484-233MBC
CY39050V208-125NTC
CY39050V256-125BBC
CY39050V388-125MGC
CY39050V484-125MBC
CY39050V208-125NTI
CY39050V256-125BBI
CY39050V208-83NTC
CY39050V256-83BBC
CY39050V388-83MGC
CY39050V484-83MBC
CY39050V208-83NTI
CY39050V256-83BBI
CY39100V208B-200NTC
CY39100V256B-200BBC
CY39100V484B-200BBC
CY39100V388B-200MGC
CY39100V676B-200MBC
Package
Name
NT208
BB256
MB256
NT208
BB256
MB256
NT208
BB256
NT208
BB256
MB256
NT208
BB256
NT208
BB256
MG388
MB484
NT208
BB256
MG388
MB484
NT208
BB256
NT208
BB256
MG388
MB484
NT208
BB256
NT208
BB256
BB484
MG388
MB676
Package Type
Self-Boot
Solution
Operating
Range
Commercial
208-Lead Enhanced Quad Flat Pack
256-Lead Fine Pitch Ball Grid Array
256-Lead Fine Pitch Ball Grid Array
208-Lead Enhanced Quad Flat Pack
256-Lead Fine Pitch Ball Grid Array
256-Lead Fine Pitch Ball Grid Array
208-Lead Enhanced Quad Flat Pack
256-Lead Fine Pitch Ball Grid Array
208-Lead Enhanced Quad Flat Pack
256-Lead Fine Pitch Ball Grid Array
256-Lead Fine Pitch Ball Grid Array
208-Lead Plastic Quad Flat Pack
256-Lead Fine Pitch Ball Grid Array
208-Lead Enhanced Quad Flat Pack
256-Lead Fine Pitch Ball Grid Array
388-Lead Ball Grid Array
484-Lead Fine Pitch Ball Grid Array
208-Lead Enhanced Quad Flat Pack
256-Lead Fine Pitch Ball Grid Array
388-Lead Pitch Ball Grid Array
484-Lead Fine Pitch Ball Grid Array
208-Lead Enhanced Quad Flat Pack
256-Lead Fine Pitch Ball Grid Array
208-Lead Enhanced Quad Flat Pack
256-Lead Fine Pitch Ball Grid Array
388-Lead Ball Grid Array
484-Lead Fine Pitch Ball Grid Array
208-Lead Plastic Quad Flat Pack
256-Lead Fine Pitch Ball Grid Array
208-Lead Enhanced Quad Flat Pack
256-Lead Fine Pitch Ball Grid Array
484-Lead Fine Pitch Ball Grid Array
388-Lead Ball Grid Array
676-Lead Fine Pitch Ball Grid Array
÷
125
÷
Industrial
83
Commercial
÷
Industrial
39K50
233
Commercial
÷
÷
125
÷
÷
39K50
125
Industrial
83
Commercial
÷
÷
Industrial
39K100
200
Commercial
÷
÷
相关PDF资料
PDF描述
CY39200V256-233MBI CPLDs at FPGA Densities
CY39200V256-233NC CPLDs at FPGA Densities
CY39200V256-233NI CPLDs at FPGA Densities
CY39200V256-233NTI CPLDs at FPGA Densities
CY39200V256-83BBC CPLDs at FPGA Densities
相关代理商/技术参数
参数描述
CY39200V256-233MGC 制造商:CYPRESS 制造商全称:Cypress Semiconductor 功能描述:CPLDs at FPGA Densities
CY39200V256-233MGI 制造商:CYPRESS 制造商全称:Cypress Semiconductor 功能描述:CPLDs at FPGA Densities
CY39200V256-233NTC 制造商:CYPRESS 制造商全称:Cypress Semiconductor 功能描述:CPLDs at FPGA Densities
CY39200V388-125MGC 功能描述:IC CPLD 200K GATE 388-BGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - CPLD(复杂可编程逻辑器件) 系列:Delta 39K™ ISR™ 标准包装:40 系列:ispMACH® 4000C 可编程类型:系统内可编程 最大延迟时间 tpd(1):5.0ns 电压电源 - 内部:1.65 V ~ 1.95 V 逻辑元件/逻辑块数目:32 宏单元数:512 门数:- 输入/输出数:128 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:176-LQFP 供应商设备封装:176-TQFP(24x24) 包装:托盘
CY39200V388-181MGC 制造商:Cypress Semiconductor 功能描述: