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参数资料
| 型号： | CY7C1069AV33-10BAC |
| 厂商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分类： | SRAM |
| 英文描述： | 2M x 8 Static RAM |
| 中文描述： | 2M X 8 STANDARD SRAM, 10 ns, PBGA60 |
| 封装： | 8 X 20 MM, 1.20 MM HEIGHT, FBGA-60 |
| 文件页数： | 7/12页 |
| 文件大小： | 460K |
| 代理商： | CY7C1069AV33-10BAC |
CY7C1069AV33
Document #: 38-05255 Rev. *G
Page 4
Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the
device. User guidelines are not tested.
Storage Temperature ................................. –65
°C to +150°C
Ambient Temperature with
Power Applied ............................................ –55
°C to +125°C
DC Voltage Applied to Outputs
Current into Outputs (LOW)......................................... 20 mA
Operating Range
Range
Ambient
Temperature
VCC
Commercial
0
°C to +70°C
3.3V
± 0.3V
Industrial
–40
°C to +85°C
Notes
3. VIL (min.) = –2.0V for pulse durations of less than 20 ns.
4. Tested initially and after any design or process changes that may affect these parameters.
DC Electrical Characteristics Over the Operating Range
Parameter
Description
Test Conditions
–10
–12
Unit
Min
Max
Min
Max
VOH
Output HIGH Voltage
VCC = Min., IOH = –4.0 mA
2.4
V
VOL
Output LOW Voltage
VCC = Min., IOL = 8.0 mA
0.4
V
VIH
Input HIGH Voltage
2.0
VCC + 0.3
2.0
VCC + 0.3
V
VIL
Input LOW Voltage[3]
–0.3
0.8
–0.3
0.8
V
IIX
Input Leakage Current
GND < VI < VCC
–1
+1
–1
+1
μA
IOZ
Output Leakage Current GND < VOUT < VCC, Output Disabled
–1
+1
–1
+1
μA
ICC
VCC Operating
Supply Current
VCC = Max.,
f = fMAX = 1/tRC
275
260
mA
ISB1
Automatic CE
Power Down Current
—TTL Inputs
CE2 < VIL,
Max. VCC, CE1 > VIH
VIN > VIH or VIN < VIL, f = fMAX
70
mA
ISB2
Automatic CE
Power Down Current
—CMOS Inputs
CE2 < 0.3V, Max. VCC,
CE1> VCC – 0.3V,
VIN > VCC – 0.3V,
or VIN < 0.3V, f = 0
50
mA
Capacitance
Tested initially and after any design or process changes that may affect these parameters.[4]
Parameter
Description
Test Conditions
TSOP II
FBGA
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz, VCC = 3.3V
6
8
pF
COUT
I/O Capacitance
8
10
pF
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相关代理商/技术参数 |
参数描述 |
|---|---|
| CY7C1069AV33-10BAI | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1069AV33-10ZC | 制造商:Cypress Semiconductor 功能描述: 制造商:Rochester Electronics LLC 功能描述: |
| CY7C1069AV33-10ZXC | 功能描述:静态随机存取存储器 2M x 8 CPG COM Fast Async 静态随机存取存储器 RoHS:否 制造商:Cypress Semiconductor 存储容量:16 Mbit 组织:1 M x 16 访问时间:55 ns 电源电压-最大:3.6 V 电源电压-最小:2.2 V 最大工作电流:22 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:TSOP-48 封装:Tray |
| CY7C1069AV33-10ZXCT | 功能描述:静态随机存取存储器 2M x 8 CPG COM Fast Async 静态随机存取存储器 RoHS:否 制造商:Cypress Semiconductor 存储容量:16 Mbit 组织:1 M x 16 访问时间:55 ns 电源电压-最大:3.6 V 电源电压-最小:2.2 V 最大工作电流:22 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:TSOP-48 封装:Tray |
| CY7C1069AV33-10ZXI | 功能描述:静态随机存取存储器 2M x 8 CPG IND Fast Async 静态随机存取存储器 RoHS:否 制造商:Cypress Semiconductor 存储容量:16 Mbit 组织:1 M x 16 访问时间:55 ns 电源电压-最大:3.6 V 电源电压-最小:2.2 V 最大工作电流:22 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:TSOP-48 封装:Tray |
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