参数资料
型号: DAC8412FPZ
厂商: Analog Devices Inc
文件页数: 18/20页
文件大小: 0K
描述: IC DAC 12BIT QUAD W/READBK 28DIP
产品培训模块: Data Converter Fundamentals
DAC Architectures
产品变化通告: DAC8412/3 Redesign and Fab Process Change 01/Oct/2009
标准包装: 13
设置时间: 6µs
位数: 12
数据接口: 并联
转换器数目: 4
电压电源: 单电源
功率耗散(最大): 330mW
工作温度: -40°C ~ 85°C
安装类型: 通孔
封装/外壳: 28-DIP(0.600",15.24mm)
供应商设备封装: 28-PDIP
包装: 管件
输出数目和类型: 4 电压,单极;4 电压,双极
采样率(每秒): 167k
Data Sheet
DAC8412/DAC8413
Rev. G | Page 7 of 20
ABSOLUTE MAXIMUM RATINGS
TA = +25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VSS to VDD
0.3 V, +33.0 V
VSS to VLOGIC
0.3 V, +33.0 V
VLOGIC to DGND
0.3 V, +7.0 V
VSS to VREFL
0.3 V, +VSS 2.0 V
VREFH to VDD
+2.0 V, +33.0 V
VREFH to VREFL
+2.0 V, VSS VDD
Current into Any VSS pin
±15 mA
Digital Input Voltage to DGND
0.3 V, VLOGIC + 0.3 V
Digital Output Voltage to DGND
0.3 V, +7.0 V
Operating Temperature Range
EP, FP, FPC
40°C to +85°C
AT, BT, BTC
55°C to +125°C
Junction Temperature
150°C
Storage Temperature Range
65°C to +150°C
Power Dissipation Package
1000 mW
Lead Temperature
JEDEC Industry Standard
Soldering
J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case mounting conditions, that is, a
device in socket.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
28-Lead Plastic DIP (PDIP)
48
22
°C/W
28-Terminal Ceramic Leadless Chip Carrier (LLC)
70
28
°C/W
28-Lead Plastic Leaded Chip Carrier (PLLC)
63
25
°C/W
28-Lead Ceramic Dual In-Line Package (CERDIP)
51
9
°C/W
ESD CAUTION
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