参数资料
型号: DC1018B-B
厂商: Linear Technology
文件页数: 14/26页
文件大小: 0K
描述: DEMO BOARD FOR LT4356-2
设计资源: DC1018B Design File
DC1018B Schematic
标准包装: 1
主要目的: 过压防护
嵌入式:
已用 IC / 零件: LT4356-2
已供物品:
相关产品: LT4356HDE-3-ND - IC REG OVP FAULT TIMER 12DFN
LT4356HS-3#PBF-ND - IC REG OVP W/LATCHOFF 16SOIC
LT4356HMS-3#PBF-ND - IC REG OVP W/LATCHOFF 10-MSOP
LT4356HDE-3#PBF-ND - IC REG OVP W/LATCHOFF 12DFN
LT4356HS-3#TRPBF-ND - IC REG OVP FAULT TIMER 16SOIC
LT4356HMS-3#TRPBF-ND - IC REG OVP FAULT TIMER 10MSOP
LT4356HDE-3#TRPBF-ND - IC REG OVP FAULT TIMER 12DFN
LT4356MPS-2#TRPBF-ND - IC SURGE STOPPER ADJ 16-SOIC
LT4356MPS-1#TRPBF-ND - IC SURGE STOPPER ADJ 16-SOIC
LT4356MPMS-1#TRPBF-ND - IC SURGE STOPPER ADJ 10-MSOP
更多...
LT4356-1/LT4356-2
APPLICATIONS INFORMATION
MOSFET stress is the result of power dissipated within
the device. For long duration surges of 100ms or more,
stress is increasingly dominated by heat transfer; this is
a matter of device packaging and mounting, and heatsink
thermal mass. This is analyzed by simulation, using the
V REG
V PK
MOSFET thermal model.
V IN
t r
I LOAD 2 ( V PK – V REG ) τ
P 2 t =
(W 2 s)
? 1 ( b ? a ) 3 1 ? b ? ?
? ?
P 2 t = I LOAD 2 ? tr + τ ? 2a 2 ln + 3a 2 + b 2 ? 4ab ? ?
? ? 3
?
Forshortdurationtransientsoflessthan100ms,MOSFET
survival is increasingly a matter of safe operating area
(SOA), an intrinsic property of the MOSFET. SOA quanti-
?es the time required at any given condition of V DS and
I D to raise the junction temperature of the MOSFET to its
rated maximum. MOSFET SOA is expressed in units of
watt-squared-seconds (P 2 t). This ?gure is essentially con-
stant for intervals of less than 100ms for any given device
type, and rises to in?nity under DC operating conditions.
Destruction mechanisms other than bulk die temperature
distort the lines of an accurately drawn SOA graph so that
P 2 t is not the same for all combinations of I D and V DS .
In particular P 2 t tends to degrade as V DS approaches the
maximum rating, rendering some devices useless for
absorbing energy above a certain voltage.
Calculating Transient Stress
To select a MOSFET suitable for any given application, the
SOA stress must be calculated for each input transient
which shall not interrupt operation. It is then a simple matter
to chose a device which has adequate SOA to survive the
maximum calculated stress. P 2 t for a prototypical transient
waveform is calculated as follows (Figure 4).
Let
a = V REG – V IN
b = V PK – V IN
(V IN = Nominal Input Voltage)
Then
b 2 ? a
4356 F04
Figure 4. Safe Operating Area Required to Survive Prototypical
Transient Waveform
Typically V REG ≈ V IN and τ >> t r simplifying the above to
1 2
2
For the transient conditions of V PK = 80V, V IN = 12V, V REG
= 16V, t r = 10μs and τ = 1ms, and a load current of 3A, P 2 t
is 18.4W 2 s—easily handled by a MOSFET in a D-pak pack-
age. The P 2 t of other transient waveshapes is evaluated by
integrating the square of MOSFET power versus time.
Calculating Short-Circuit Stress
SOA stress must also be calculated for short-circuit condi-
tions. Short-circuit P 2 t is given by:
P 2 t = (V IN ? Δ V SNS /R SNS ) 2 ? t TMR (W 2 s)
where, Δ V SNS is the SENSE pin threshold, and t TMR is the
overcurrent timer interval.
For V IN = 14.7V, V SNS = 50mV, R SNS = 12m Ω and C TMR
= 100nF, P 2 t is 6.6W 2 s—less than the transient SOA
calculated in the previous example. Nevertheless, to
account for circuit tolerances this ?gure should be doubled
to 13.2W 2 s.
Limiting Inrush Current and GATE Pin Compensation
The LT4356 limits the inrush current to any load capacitance
by controlling the GATE pin voltage slew rate. An external
capacitor can be connected from GATE to ground to slow
down the inrush current further at the expense of slower
turn-off time. The gate capacitor is set at:
C1 =
I GATE(UP)
I INRUSH
?C L
4356fa
14
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