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参数资料
| 型号： | DC1367A |
| 厂商： | Linear Technology |
| 文件页数： | 18/24页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL LTM4615 |
| 软件下载： | LTM4615 |
| 设计资源： | DC1367A Design Files DC1367A Schematic |
| 标准包装： | 1 |
| 系列： | LTM®, uModule® |
| 主要目的： | DC/DC，LDO 步降 |
| 输出及类型： | 3，非隔离 |
| 输出电压： | 1.8V，1.2V，1V |
| 电流 - 输出： | 4A，2.5A，1.5A |
| 输入电压： | 2.5 ~ 5.5 V |
| 稳压器拓扑结构： | 降压 |
| 频率 - 开关： | 1.25MHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | LTM4615 |
| 相关产品： | LTM4615EV#PBF-ND - IC SWIT REG BUCK 4A ADJ 144LGA LTM4615IV#PBF-ND - IC SWIT REG BUCK 4A ADJ 144LGA |
LTM4615
APPLICATIONS INFORMATION
Safety Considerations
The LTM4615 modules do not provide galvanic isolation
from V IN to V OUT . There is no internal fuse. If required,
a slow blow fuse with a rating twice the maximum input
current needs to be provided to protect each unit from
catastrophic failure.
Layout Checklist/Example
The high integration of LTM4615 makes the PCB board
layout very simple and easy. However, to optimize its electri-
cal and thermal performance, some layout considerations
are still necessary.
? Use large PCB copper areas for high current path,
including V IN , GND and V OUT . It helps to minimize the
PCB conduction loss and thermal stress.
GND1 CONTROL
C IN1
? Place high frequency ceramic input and output capaci -
tors next to the V IN , GND and V OUT pins to minimize
high frequency noise.
? Place a dedicated power ground layer underneath the
unit.
? To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnection
between the top layer and other power layers.
? Do not put via directly on pads unless the via is capped.
Figure 11 gives a good example of the recommended layout.
V OUT1
GND1
M
L
C OUT1 C OUT2 V
OUT1
LD0_IN IN2
SW1
V IN1
GND1
GND3
C
K
J
H
G
F
C OUT3
GND1
LDO_OUT
GND3
CONTROL
GND2
V IN2
E
D
C
C OUT4 C OUT5
V OUT2
B
GND2
A
GND2
C IN3
1
2
3
4
5
6
7
8
9
10 11 12
GND2
SW2
GND2
4615 F11
Figure 11. Recommended PCB Layout
18
For more information www.linear.com/LTM4615
4615fb
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相关代理商/技术参数 |
参数描述 |
|---|---|
| DC1369A-A | 功能描述:BOARD DEMO 125MSPS LTC2261-14 RoHS:是 类别:未定义的类别 >> 其它 系列:* 标准包装:1 系列:* 其它名称:MS305720A |
| DC1369A-B | 功能描述:BOARD DEMO 105MSPS LTC2260-14 RoHS:是 类别:未定义的类别 >> 其它 系列:* 标准包装:1 系列:* 其它名称:MS305720A |
| DC1369A-C | 功能描述:BOARD DEMO 80MSPS LTC2259-14 RoHS:是 类别:未定义的类别 >> 其它 系列:* 标准包装:1 系列:* 其它名称:MS305720A |
| DC1369A-D | 制造商:Linear Technology 功能描述:14BIT ADC Eval Brd, Rq. DC1371 & DC1075 制造商:Linear Technology 功能描述:14BIT ADC Eval Brd, Rq. DC1371 & DC1075; Silicon Manufacturer:Linear Technology; Silicon Core Number:LTC2258-14; Kit Application Type:Data Converter; Application Sub Type:ADC; Kit Contents:Board, Guide |
| DC1369A-E | 制造商:Linear Technology 功能描述:14BIT ADC Eval Brd, Rq. DC1371 & DC1075 制造商:Linear Technology 功能描述:14BIT ADC Eval Brd, Rq. DC1371 & DC1075; Silicon Manufacturer:Linear Technology; Silicon Core Number:LTC2257-14; Kit Application Type:Data Converter; Application Sub Type:ADC; Kit Contents:Board, Guide |
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