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参数资料
| 型号： | DC1669A |
| 厂商： | Linear Technology |
| 文件页数： | 18/32页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL LTM4627 |
| 软件下载： | LTM4627 Spice Model |
| 设计资源： | LTM4627 Gerber Files DC1669A Design Files |
| 标准包装： | 1 |
| 系列： | LTM®, uModule® |
| 主要目的： | DC/DC，步升 |
| 输出及类型： | 1，非隔离 |
| 输出电压： | 1V，1.2V，1.5V，1.8V，2.5V，3.3V |
| 电流 - 输出： | 15A |
| 输入电压： | 4.5 ~ 20 V |
| 稳压器拓扑结构： | 降压 |
| 频率 - 开关： | 500kHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | LTM4627 |
| 相关产品： | LTM4627IV#PBF-ND - IC UMODULE DC/DC 15A 133LGA LTM4627EV#PBF-ND - IC UMODULE DC/DC 15A 133LGA |
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LTM4627
APPLICATIONS INFORMATION
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
JUNCTION-TO-CASE (TOP)
RESISTANCE
CASE (TOP)-TO-AMBIENT
RESISTANCE
JUNCTION
JUNCTION-TO-BOARD RESISTANCE
At
μMODULE DEVICE
JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
CASE (BOTTOM)-TO-BOARD
RESISTANCE
BOARD-TO-AMBIENT
RESISTANCE
80421 F05
Figure 6. Graphical Representation of JESD 51-12 Thermal Coefficients
Within the LTM4627, be aware there are multiple power
devices and components dissipating power, with a con-
sequence that the thermal resistances relative to different
junctions of components or die are not exactly linear with
respect to total package power loss. To reconcile this
complication without sacrificing modeling simplicity—
but also, not ignoring practical realities—an approach
has been taken using FEA software modeling along with
laboratory testing in a controlled-environment chamber
to reasonably define and correlate the thermal resistance
values supplied in this data sheet: (1) Initially, FEA software
is used to accurately build the mechanical geometry of
the LTM4627 and the specified PCB with all of the correct
material coefficients along with accurate power loss source
definitions; (2) this model simulates a software-defined
JEDEC environment consistent with JESD 51-12 to predict
power loss heat flow and temperature readings at different
interfaces that enable the calculation of the JEDEC-defined
thermal resistance values; (3) the model and FEA software
is used to evaluate the LTM4627 with heat sink and airflow;
(4) having solved for and analyzed these thermal resis-
tance values and simulated various operating conditions
in the software model, a thorough laboratory evaluation
replicates the simulated conditions with thermocouples
within a controlled-environment chamber while operat-
ing the device at the same power loss as that which was
simulated. An outcome of this process and due diligence
yields the set of derating curves shown in this data sheet.
The 1.2V and 3.3V power loss curves in Figures 7 and 8
can be used in coordination with the load current derating
curves in Figures 9 to 16 for calculating an approximate
θ JA thermal resistance for the LTM4627 with various heat
sinking and airflow conditions. The power loss curves
are taken at room temperature, and are increased with
multiplicative factors according to the ambient tempera-
ture. These approximate factors are: 1 for 40°C; 1.05 for
50°C; 1.1 for 60°C; 1.15 for 70°C; 1.2 for 80°C; 1.25 for
90°C; 1.3 for 100°C; 1.35 for 110°C and 1.4 for 120°C.
The derating curves are plotted with the output current
starting at 15A and the ambient temperature at 40°C. The
output voltages are 1.2V, and 3.3V. These are chosen to
include the lower and higher output voltage ranges for
correlating the thermal resistance. Thermal models are
derived from several temperature measurements in a con-
trolled temperature chamber along with thermal modeling
analysis. The junction temperatures are monitored while
ambient temperature is increased with and without airflow.
The power loss increase with ambient temperature change
is factored into the derating curves. The junctions are
maintained at 120°C maximum while lowering output
current or power with increasing ambient temperature.
The decreased output current will decrease the inter-
nal module loss as ambient temperature is increased.
The monitored junction temperature of 120°C minus
the ambient operating temperature specifies how much
module temperature rise can be allowed. As an example in
4627fc
18
For more information www.linear.com/LTM4627
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| DC1669B | 制造商:Linear Technology 功能描述:LTM4627EV Demo Board 20V, 15A DC/DC 制造商:Linear Technology 功能描述:LTM4627EV Demo Board 20V, 15A DC/DC Module Regulator |
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| DC16-73LF | 功能描述:信号调节 .3-2.7GHz Coupling 15.6dB and 14.8dB RoHS:否 制造商:EPCOS 产品:Duplexers 频率:782 MHz, 751 MHz 频率范围: 电压额定值: 带宽: 阻抗:50 Ohms 端接类型:SMD/SMT 封装 / 箱体:2.5 mm x 2 mm 工作温度范围:- 30 C to + 85 C 封装:Reel |
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| DC1676A | 制造商:Linear Technology 功能描述:BOARD DEMO LTC4359 制造商:Linear Technology 功能描述:DEMO BOARD, LTC4359, IDEAL DIODE CONTROLLER; Silicon Manufacturer:Linear Technology; Silicon Core Number:LTC4359; Kit Application Type:Power Management; Application Sub Type:Ideal Diode; Kit Contents:Demo Board LTC4359 |
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