参数资料
型号: DC1669A
厂商: Linear Technology
文件页数: 23/32页
文件大小: 0K
描述: BOARD EVAL LTM4627
软件下载: LTM4627 Spice Model
设计资源: LTM4627 Gerber Files
DC1669A Design Files
标准包装: 1
系列: LTM®, uModule®
主要目的: DC/DC,步升
输出及类型: 1,非隔离
输出电压: 1V,1.2V,1.5V,1.8V,2.5V,3.3V
电流 - 输出: 15A
输入电压: 4.5 ~ 20 V
稳压器拓扑结构: 降压
频率 - 开关: 500kHz
板类型: 完全填充
已供物品:
已用 IC / 零件: LTM4627
相关产品: LTM4627IV#PBF-ND - IC UMODULE DC/DC 15A 133LGA
LTM4627EV#PBF-ND - IC UMODULE DC/DC 15A 133LGA
LTM4627
APPLICATIONS INFORMATION
Safety Considerations
The LTM4627 modules do not provide isolation from V IN
to V OUT . There is no internal fuse. If required, a slow blow
fuse with a rating twice the maximum input current needs
to be provided to protect each unit from catastrophic
failure. The device does support overvoltage protection
and overcurrent protection.
Layout Checklist/Example
The high integration of the LTM4627 makes the PCB
board layout very simple and easy. However, to optimize
its electrical and thermal performance, some layout con-
siderations are still necessary.
? Use large PCB copper areas for high current paths,
including V IN , GND and V OUT . It helps to minimize the
PCB conduction loss and thermal stress.
? Place high frequency ceramic input and output capaci-
tors next to the V IN , GND and V OUT pins to minimize
high frequency noise.
V IN
? Place a dedicated power ground layer underneath the
unit.
? To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
? Do not put vias directly on the pad, unless they are
capped or plated over.
? Place test points on signal pins for testing.
? Use a separated SGND ground copper area for com-
ponents connected to signal pins. Connect the SGND
to GND underneath the unit.
? For parallel modules, tie the COMP and V FB pins to-
gether. Use an internal layer to closely connect these
pins together.
Figure 17 gives a good example of the recommended
layout. LGA and BGA PCB layouts are identical with the
exception of circle pads for BGA (see Package Description).
C IN
C IN
CONTROL
GND
SIGNAL
GROUND
V OUT
C OUT
C OUT
Figure 17. Recommended PCB Layout
(LGA Shown, for BGA Use Circle Pads)
V OUT
4627 F17
4627fc
For more information www.linear.com/LTM4627
23
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