参数资料
型号: DS1222
厂商: DALLAS SEMICONDUCTOR
元件分类: 微控制器/微处理器
英文描述: BankSwitch Chip(存储器组切换芯片)
中文描述: SPECIALTY MICROPROCESSOR CIRCUIT, PDIP14
封装: 0.300 INCH, DIP-14
文件页数: 2/4页
文件大小: 46K
代理商: DS1222
DS1222
022698 2/4
shown in Table 1. The last five cycles must match the
exact bit pattern as shown for addresses AX, AY, and
AZ. However, address line AW defines the bank num-
ber to be enabled as per Table 2.
Switching to a selected bank of memory occurs on the
rising edge of CEI when the last set of bits is input and a
match has been established. After bank selection CEO
always follows CEI with a maximum propagation delay
of 15 ns. The bank selected is determined by the levels
set on Bank Select 1 through Bank Select 4 as per Table
2. These levels are held constant for all memory cycles
until a new memory bank is selected.
ADDRESS BIT SEQUENCE
Table 1
BIT SEQUENCE
ADDRESS
INPUTS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
A
W
1
0
1
0
0
0
1
1
0
1
0
x
x
x
x
x
A
X
0
1
0
1
1
1
0
0
1
0
1
0
0
0
1
1
A
Y
1
0
1
0
0
0
1
1
0
1
0
1
1
1
0
0
A
Z
0
1
0
1
1
1
0
0
1
0
1
0
0
0
1
1
X See Table 2
BANK SELECT CONTROL
Table 2
Bank
A
W
Bit Sequence
Outputs
Selected
11
12
13
14
15
BS1
BS2
BS3
BS4
*Banks Off
0
X
X
X
X
Low
Low
Low
Low
Bank 0
1
0
0
0
0
Low
Low
Low
Low
Bank 1
1
0
0
0
1
High
Low
Low
Low
Bank 2
1
0
0
1
0
Low
High
Low
Low
Bank 3
1
0
0
1
1
High
High
Low
Low
Bank 4
1
0
1
0
0
Low
Low
High
Low
Bank 5
1
0
1
0
1
High
Low
High
Low
Bank 6
1
0
1
1
0
Low
High
High
Low
Bank 7
1
0
1
1
1
High
High
High
Low
Bank 8
1
1
0
0
0
Low
Low
Low
High
Bank 9
1
1
0
0
1
High
Low
Low
High
Bank 10
1
1
0
1
0
Low
High
Low
High
Bank 11
1
1
0
1
1
High
High
Low
High
Bank 12
1
1
1
0
0
Low
Low
High
High
Bank 13
1
1
1
0
1
High
Low
High
High
Bank 14
1
1
1
1
0
Low
High
High
High
Bank 15
1
1
1
1
1
High
High
High
High
*CEO = V
IH
independent of CEI
相关PDF资料
PDF描述
DS1225AB 64K Nonvolatile SRAM(64K非易失性静态RAM)
DS1225AD 16K Nonvolatile SRAM(64K非易失性SRAM)
DS1225Y 64K Nonvolatile SRAM(64K 非易失性静态RAM)
DS1230AB(中文) 256K NV SRAM(256K非易失性SRAM)
DS1230W 3.3V 256K Nonvolatile SRAM(3.3V 256K 非易失性静态RAM)
相关代理商/技术参数
参数描述
DS1222+ 功能描述:IC BANKSWITCH CMOS 14-DIP RoHS:是 类别:集成电路 (IC) >> 存储器 - 控制器 系列:- 标准包装:45 系列:- 控制器类型:静态 RAM(SRAM) 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 封装/外壳:16-SOIC(0.295",7.50mm 宽) 供应商设备封装:16-SOIC W 包装:管件
DS1222N 功能描述:IC BANKSWITCH CMOS IND 14-DIP RoHS:否 类别:集成电路 (IC) >> 存储器 - 控制器 系列:- 标准包装:45 系列:- 控制器类型:静态 RAM(SRAM) 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 封装/外壳:16-SOIC(0.295",7.50mm 宽) 供应商设备封装:16-SOIC W 包装:管件
DS1222S 功能描述:电源开关 IC - 配电 RoHS:否 制造商:Exar 输出端数量:1 开启电阻(最大值):85 mOhms 开启时间(最大值):400 us 关闭时间(最大值):20 us 工作电源电压:3.2 V to 6.5 V 电源电流(最大值): 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5
DS1222S+ 功能描述:IC BANKSWITCH CMOS 16-SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 - 控制器 系列:- 标准包装:45 系列:- 控制器类型:静态 RAM(SRAM) 电源电压:4.5 V ~ 5.5 V 工作温度:0°C ~ 70°C 封装/外壳:16-SOIC(0.295",7.50mm 宽) 供应商设备封装:16-SOIC W 包装:管件
DS1222SN 制造商:未知厂家 制造商全称:未知厂家 功能描述: