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参数资料
| 型号： | DSP56858FVE |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 58/64页 |
| 文件大小： | 0K |
| 描述： | IC DSP 16BIT 120MHZ 144-LQFP |
| 标准包装： | 60 |
| 系列： | 568xx |
| 核心处理器： | 56800E |
| 芯体尺寸： | 16-位 |
| 速度： | 120MHz |
| 连通性： | EBI/EMI，SCI，SPI，SSI |
| 外围设备： | DMA，POR，WDT |
| 输入/输出数： | 47 |
| 程序存储器容量： | 80KB（40K x 16） |
| 程序存储器类型： | SRAM |
| RAM 容量： | 24K x 16 |
| 电压 - 电源 (Vcc/Vdd)： | 1.62 V ~ 1.98 V |
| 振荡器型： | 外部 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 144-LQFP |
| 包装： | 托盘 |
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Electrical Design Considerations
56858 Technical Data, Rev. 6
Freescale Semiconductor
61
As noted above, the junction-to-case thermal resistances quoted in this data sheet are determined using the
first definition. From a practical standpoint, that value is also suitable for determining the junction
temperature from a case thermocouple reading in forced convection environments. In natural convection,
using the junction-to-case thermal resistance to estimate junction temperature from a thermocouple
reading on the case of the package will estimate a junction temperature slightly hotter than actual. Hence,
the new thermal metric, Thermal Characterization Parameter, or
ΨJT, has been defined to be (TJ – TT)/PD.
This value gives a better estimate of the junction temperature in natural convection when using the surface
temperature of the package. Remember that surface temperature readings of packages are subject to
significant errors caused by inadequate attachment of the sensor to the surface and to errors caused by heat
loss to the sensor. The recommended technique is to attach a 40-gauge thermocouple wire and bead to the
top center of the package with thermally conductive epoxy.
6.2 Electrical Design Considerations
Use the following list of considerations to assure correct operation:
Provide a low-impedance path from the board power supply to each VDD pin on the controller, and from the
board ground to each VSS (GND) pin.
The minimum bypass requirement is to place six 0.01–0.1
μF capacitors positioned as close as possible to
the package supply pins. The recommended bypass configuration is to place one bypass capacitor on each
of the ten VDD/VSS pairs, including VDDA/VSSA.
Ensure that capacitor leads and associated printed circuit traces that connect to the chip VDD and VSS (GND)
pins are less than 0.5 inch per capacitor lead.
Use at least a four-layer Printed Circuit Board (PCB) with two inner layers for VDD and GND.
Bypass the VDD and GND layers of the PCB with approximately 100 μF, preferably with a high-grade
capacitor such as a tantalum capacitor.
Because the device’s output signals have fast rise and fall times, PCB trace lengths should be minimal.
Consider all device loads as well as parasitic capacitance due to PCB traces when calculating capacitance.
This is especially critical in systems with higher capacitive loads that could create higher transient currents
in the VDD and GND circuits.
CAUTION
This device contains protective circuitry to guard against
damage due to high static voltage or electrical fields.
However, normal precautions are advised to avoid
application of any voltages higher than maximum rated
voltages to this high-impedance circuit. Reliability of
operation is enhanced if unused inputs are tied to an
appropriate voltage level.
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| DSP56858PB_D | 制造商:未知厂家 制造商全称:未知厂家 功能描述:56858 Digital Signal Processor Product Brief |
| DSP56858VF120 | 功能描述:数字信号处理器和控制器 - DSP, DSC 120Mhz/120MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT |
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