- 您现在的位置：买卖IC网 > PDF目录3856 > DSPIC30F2012-30I/ML (Microchip Technology)IC DSPIC MCU/DSP 12K 28QFN PDF资料下载
参数资料
| 型号： | DSPIC30F2012-30I/ML |
| 厂商： | Microchip Technology |
| 文件页数： | 1/66页 |
| 文件大小： | 0K |
| 描述： | IC DSPIC MCU/DSP 12K 28QFN |
| 产品培训模块： | Serial Communications using dsPIC30F I2C Serial Communications using dsPIC30F SPI Serial Communications using dsPIC30F UART dsPIC30F 12 bit ADC - Part 2 dsPIC30F Addressing Modes - Part 1 dsPIC30F Architecture - Part 1 dsPIC30F DSP Engine & ALU dsPIC30F Interrupts dsPIC30F Motor Control PWM dsPIC Timers Asynchronous Stimulus dsPIC30F Addressing Modes - Part 2 dsPIC30F Architecture - Part 2 dsPIC30F 12-bit ADC Part 1 |
| 标准包装： | 61 |
| 系列： | dsPIC™ 30F |
| 核心处理器： | dsPIC |
| 芯体尺寸： | 16-位 |
| 速度： | 30 MIP |
| 连通性： | I²C，SPI，UART/USART |
| 外围设备： | 欠压检测/复位，POR，PWM，WDT |
| 输入/输出数： | 20 |
| 程序存储器容量： | 12KB（4K x 24） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 1K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 2.5 V ~ 5.5 V |
| 数据转换器： | A/D 10x12b |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 28-VQFN 裸露焊盘 |
| 包装： | 管件 |
| 产品目录页面： | 650 (CN2011-ZH PDF) |
| 配用： | AC164322-ND - MODULE SOCKET MPLAB PM3 28/44QFN DV164005-ND - KIT ICD2 SIMPLE SUIT W/USB CABLE |
| 其它名称： | DSPIC30F201230IML |
当前第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页
2010 Microchip Technology Inc.
DS70102K-page 1
dsPIC30F
1.0
OVERVIEW AND SCOPE
This document defines the programming specification
for the dsPIC30F family of Digital Signal Controllers
(DSCs). The programming specification is required
only for the developers of third-party tools that are used
to program dsPIC30F devices. Customers using
dsPIC30F devices should use development tools that
already provide support for device programming.
This document includes programming specifications
for the following devices:
dsPIC30F2010/2011/2012
dsPIC30F3010/3011/3012/3013/ 3014
dsPIC30F4011/4012/4013
dsPIC30F5011/5013/5015/5016
dsPIC30F6010/6011/6012/6013/6014/6015
dsPIC30F6010A/6011A/6012A/6013A/6014A
2.0
PROGRAMMING OVERVIEW
OF THE dsPIC30F
The dsPIC30F family of DSCs contains a region of on-
chip memory used to simplify device programming.
This region of memory can store a programming
executive, which allows the dsPIC30F to be
programmed faster than the traditional means. Once
the programming executive is stored to memory by an
external programmer (such as Microchip’s MPLAB
ICD 2, MPLAB PM3, PRO MATE II, or MPLAB REAL
ICE), it can then interact with the external
programmer to efficiently program devices.
The programmer and programming executive have a
master-slave relationship, where the programmer is
the master programming device and the programming
executive is the slave, as illustrated in Figure 2-1.
FIGURE 2-1:
OVERVIEW OF dsPIC30F
PROGRAMMING
Two different methods are used to program the chip in
the user’s system. One method uses the Enhanced In-
Circuit Serial Programming (Enhanced ICSP)
protocol and works with the programming executive.
The other method uses In-Circuit Serial Programming
(ICSP) protocol and does not use the programming
executive.
The Enhanced ICSP protocol uses the faster, high-
voltage method that takes advantage of the
programming executive. The programming executive
provides all the necessary functionality to erase,
program and verify the chip through a small command
set. The command set allows the programmer to
program the dsPIC30F without having to deal with the
low-level programming protocols of the chip.
The ICSP programming method does not use the
programming executive. It provides native, low-level
programming capability to erase, program and verify
the chip. This method is significantly slower because it
uses control codes to serially execute instructions on
the dsPIC30F device.
This specification describes the ICSP and Enhanced
ICSP
programming
methods.
“Programming Executive Application” describes
the
programming
executive
application
and
Section 5.0 “Device Programming” describes its
application programmer’s interface for the host
programmer.
describes the ICSP programming method.
2.1
Hardware Requirements
In ICSP or Enhanced ICSP mode, the dsPIC30F
requires two programmable power supplies: one for
VDD and one for MCLR. For Bulk Erase programming,
which is required for erasing code protection bits, VDD
must be greater than 4.5 volts. Refer to Section 13.0
for additional hardware parameters.
Programmer
dsPIC30F Device
Programming
Executive
On-chip Memory
2
dsPIC30F Flash Programming Specification
相关PDF资料 |
PDF描述 |
|---|---|
| ATMEGA16-16PI | IC AVR MCU 16K 16MHZ IND 40-DIP |
| ATMEGA128-16MI | IC AVR MCU 128K 16MHZ IND 64-QFN |
| T89C51CC02UA-SITIM | IC 8051 MCU FLASH 16K 28PLCC |
| T89C51CC01UA-SLSIM | IC 8051 MCU FLASH 32K 44PLCC |
| T89C51CC01UA-RLTIM | IC 8051 MCU FLASH 32K 44VQFP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| DSPIC30F2012A20E/ML | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:High-Performance, 16-Bit Digital Signal Controllers |
| DSPIC30F2012A-20E/ML | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:High-Performance, 16-Bit Digital Signal Controllers |
| DSPIC30F2012A20E/P | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:High-Performance, 16-Bit Digital Signal Controllers |
| DSPIC30F2012A-20E/P | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:High-Performance, 16-Bit Digital Signal Controllers |
| DSPIC30F2012A20E/SO | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:High-Performance, 16-Bit Digital Signal Controllers |
发布紧急采购，3分钟左右您将得到回复。