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型号： DSPIC30F3012-20I/P
厂商： Microchip Technology
文件页数： 111/161页
文件大小： 0K
描述： IC DSPIC MCU/DSP 24K 18DIP
产品培训模块： Serial Communications using dsPIC30F I2C
Serial Communications using dsPIC30F SPI
Serial Communications using dsPIC30F UART
dsPIC30F 12 bit ADC - Part 2
dsPIC30F Addressing Modes - Part 1
dsPIC30F Architecture - Part 1
dsPIC30F DSP Engine & ALU
dsPIC30F Interrupts
dsPIC30F Motor Control PWM
dsPIC Timers
Asynchronous Stimulus
dsPIC30F Addressing Modes - Part 2
dsPIC30F Architecture - Part 2
dsPIC30F 12-bit ADC Part 1
标准包装： 25
系列： dsPIC™ 30F
核心处理器： dsPIC
芯体尺寸： 16-位
速度： 20 MIPS
连通性： I²C，SPI，UART/USART
外围设备： 欠压检测/复位，POR，PWM，WDT
输入/输出数： 12
程序存储器容量： 24KB（8K x 24）
程序存储器类型： 闪存
EEPROM 大小： 1K x 8
RAM 容量： 2K x 8
电压 - 电源 (Vcc/Vdd)： 2.5 V ~ 5.5 V
数据转换器： A/D 8x12b
振荡器型： 内部
工作温度： -40°C ~ 85°C
封装/外壳： 18-DIP（0.300"，7.62mm）
包装： 管件
配用： AC30F005-ND - MODULE SCKT DSPIC30F 18DIP/SOIC
ACICE0202-ND - ADAPTER MPLABICE 18P 300 MIL
其它名称： DSPIC30F3012-20IP
2010 Microchip Technology Inc.
DS70139G-page 39
dsPIC30F2011/2012/3012/3013
All byte loads into any W register are loaded into the
LSB. The MSB is not modified.
A Sign-Extend (SE) instruction is provided to allow
users to translate 8-bit signed data to 16-bit signed
values. Alternatively, for 16-bit unsigned data, users
can clear the MSB of any W register by executing a
Zero-Extend (ZE) instruction on the appropriate
address.
Although most instructions are capable of operating on
word or byte data sizes, it should be noted that some
instructions, including the DSP instructions, operate
only on words.
3.2.5
NEAR DATA SPACE
An 8 Kbyte near data space is reserved in X address
memory space between 0x0000 and 0x1FFF, which is
directly addressable via a 13-bit absolute address field
within all memory direct instructions. The remaining X
address space and all of the Y address space is
addressable indirectly. Additionally, the whole of X data
space is addressable using MOV instructions, which
support memory direct addressing with a 16-bit
address field.
3.2.6
SOFTWARE STACK
The dsPIC DSC devices contain a software stack. W15
is used as the Stack Pointer.
The Stack Pointer always points to the first available
free word and grows from lower addresses towards
higher addresses. It pre-decrements for stack pops
and post-increments for stack pushes, as shown in
Figure 3-10. Note that for a PC push during any CALL
instruction, the MSB of the PC is zero-extended before
the push, ensuring that the MSB is always clear.
FIGURE 3-10:
CALL
STACK FRAME
There is a Stack Pointer Limit register (SPLIM)
associated
with
the
Stack
Pointer.
SPLIM
is
uninitialized at Reset. As is the case for the Stack
Pointer, SPLIM<0> is forced to ‘0’ because all stack
operations must be word aligned. Whenever an
Effective Address (EA) is generated using W15 as a
source or destination pointer, the address thus
generated is compared with the value in SPLIM. If the
contents of the Stack Pointer (W15) and the SPLIM reg-
ister are equal, and a push operation is performed, a
stack error trap does not occur. The stack error trap
occurs on a subsequent push operation. Thus, for
example, if it is desirable to cause a stack error trap
when the stack grows beyond address 0x2000 in RAM,
initialize the SPLIM with the value, 0x1FFE.
Similarly, a Stack Pointer underflow (stack error) trap is
generated when the Stack Pointer address is found to
be less than 0x0800, thus preventing the stack from
interfering with the Special Function Register (SFR)
space.
A write to the SPLIM register should not be immediately
followed by an indirect read operation using W15.
Note:
A PC push during exception processing
concatenates the SRL register to the MSB
of the PC prior to the push.
<Free Word>
PC<15:0>
000000000
0
15
W15 (before CALL)
W15 (after CALL)
S
tac
k
Gr
ow
s
T
o
w
a
rd
s
Hi
gh
er
A
d
re
s
0x0000
PC<22:16>
POP
: [--W15]
PUSH : [W15++]
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相关代理商/技术参数
参数描述
DSPIC30F3012-30I/ML 功能描述:数字信号处理器和控制器 - DSP, DSC Sensor RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
DSPIC30F3012-30I/P 功能描述:数字信号处理器和控制器 - DSP, DSC Sensor RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
DSPIC30F3012-30I/SO 功能描述:数字信号处理器和控制器 - DSP, DSC Sensor RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
dsPIC30F3012T-20E/ML 功能描述:数字信号处理器和控制器 - DSP, DSC 44LD 20MIPS 24 KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
dsPIC30F3012T-20E/SO 功能描述:数字信号处理器和控制器 - DSP, DSC 18LD 20MIPS 24 KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
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