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参数资料
型号： DSPIC33FJ128GP202-I/SP
厂商： Microchip Technology
文件页数： 14/73页
文件大小： 0K
描述： IC DSPIC MCU/DSP 128K 28DIP
特色产品： PIC24FJ/33FJ MCUs & dsPIC? DSCs
标准包装： 15
系列： dsPIC™ 33F
核心处理器： dsPIC
芯体尺寸： 16-位
速度： 40 MIP
连通性： I²C，IrDA，LIN，SPI，UART/USART
外围设备： AC'97，欠压检测/复位，DMA，I²S，POR，PWM，WDT
输入/输出数： 21
程序存储器容量： 128KB（128K x 8）
程序存储器类型： 闪存
RAM 容量： 8K x 8
电压 - 电源 (Vcc/Vdd)： 3 V ~ 3.6 V
数据转换器： A/D 10x10b/12b
振荡器型： 内部
工作温度： -40°C ~ 85°C
封装/外壳： 28-DIP（0.300"，7.62mm）
包装： 管件
产品目录页面： 653 (CN2011-ZH PDF)
配用： MA330019-ND - PIM DSPIC33F MC 44P-100P QFN
DV164033-ND - KIT START EXPLORER 16 MPLAB ICD2
DV164005-ND - KIT ICD2 SIMPLE SUIT W/USB CABLE
2007-2012 Microchip Technology Inc.
DS70292G-page 21
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
2.5
ICSP Pins
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming (ICSP) and debugging pur-
poses. It is recommended to keep the trace length
between the ICSP connector and the ICSP pins on the
device as short as possible. If the ICSP connector is
expected to experience an ESD event, a series resistor
is recommended, with the value in the range of a few
tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes, and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communi-
cations to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternatively, refer to the AC/DC characteristics and
timing requirements information in the respective
device Flash programming specification for information
on capacitive loading limits and pin input voltage high
(VIH) and input low (VIL) requirements.
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB ICD 3 or MPLAB REAL ICE.
For more information on ICD 3 and REAL ICE
connection requirements, refer to the following
documents that are available on the Microchip website.
“Using MPLAB ICD 3 In-Circuit Debugger”
(poster) DS51765
“MPLAB ICD 3 Design Advisory” DS51764
“MPLAB REAL ICE In-Circuit Emulator User’s
Guide” DS51616
“Using MPLAB REAL ICE” (poster) DS51749
2.6
External Oscillator Pins
Many DSCs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to Section 9.0 “Oscillator
Configuration” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Also, place the
oscillator circuit close to the respective oscillator pins,
not exceeding one-half inch (12 mm) distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces inside the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed. A
suggested
layout
is
shown
in
Figure 2-3.
Recommendations
for
crystals
and
ceramic
resonators are provided in Table 2-1 and Table 2-2,
respectively.
FIGURE 2-3:
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
TABLE 2-1:
CRYSTAL RECOMMENDATIONS
13
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
14
15
16
17
18
19
20
Part
Number
Vendor
Freq.
Load
Cap.
Package
Case
Frequency
Tolerance
Mounting
Type
Operating
Temperature
ECS-40-20-4DN
ECS Inc.
4 MHz
20 pF
HC49/US
±30 ppm
TH
-40°C to +85°C
ECS-80-18-4DN
ECS Inc.
8 MHz
18 pF
HC49/US
±30 ppm
TH
-40°C to +85°C
ECS-100-18-4-DN
ECS Inc.
10 MHz
18 pF
HC49/US
±30 ppm
TH
-40°C to +85°C
ECS-200-20-4DN
ECS Inc.
20 MHz
20 pF
HC49/US
±30 ppm
TH
-40°C to +85°C
ECS-40-20-5G3XDS-TR
ECS Inc.
4 MHz
20 pF
HC49/US
±30 ppm
SM
-40°C to +125°C
ECS-80-20-5G3XDS-TR
ECS Inc.
8 MHz
20 pF
HC49/US
±30 ppm
SM
-40°C to +125°C
ECS-100-20-5G3XDS-TR ECS Inc.
10 MHz
20 pF
HC49/US
±30 ppm
SM
-40°C to +125°C
ECS-200-20-5G3XDS-TR ECS Inc.
20 MHz
20 pF
HC49/US
±30 ppm
SM
-40°C to 125°C
NX3225SA 20MHZ AT-W NDK
20 MHz
8 pF
3.2 mm x 2.5 mm
±50 ppm
SM
-40°C to 125°C
Legend:
TH = Through Hole
SM = Surface Mount
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dsPIC33FJ128GP202T-I/MM 功能描述:数字信号处理器和控制器 - DSP, DSC 16B DSC 28LD128KB DMA 40MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
dsPIC33FJ128GP202T-I/SO 功能描述:数字信号处理器和控制器 - DSP, DSC 16B DSC 28LD128KB DMA 40MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
dsPIC33FJ128GP204-E/ML 功能描述:数字信号处理器和控制器 - DSP, DSC 16b DSC 128KB Flash DMA 40MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
dsPIC33FJ128GP204-E/PT 功能描述:数字信号处理器和控制器 - DSP, DSC 16b DSC 128KB Flash DMA 40MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
dsPIC33FJ128GP204-I/ML 功能描述:数字信号处理器和控制器 - DSP, DSC 16B DSC 44LD128KB DMA 40MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
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