参数资料
型号: EM260-RTR
厂商: Silicon Laboratories Inc
文件页数: 17/50页
文件大小: 0K
描述: IC ZIGBEE SYSTEM-ON-CHIP 40-QFN
标准包装: 1
频率: 2.4GHz
数据传输率 - 最大: 250kbps
调制或协议: 802.15.4
应用: ZigBee?
功率 - 输出: -32dBm ~ 3dBm
灵敏度: -97dBm
电源电压: 2.1 V ~ 3.6 V
电流 - 接收: 30mA
电流 - 传输: 34mA
数据接口: PCB,表面贴装
天线连接器: PCB,表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 40-VFQFN 裸露焊盘
包装: 标准包装
配用: 636-1009-ND - PROGRAMMER USB FLASH EM250/260
其它名称: 636-1007-6
EM260
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Automatic acknowledgement transmission
Automatic transmission of packets from memory
Automatic transmission after backoff time if channel is clear (CCA)
Automatic acknowledgement checking
Time stamping of received and transmitted messages
Attaching packet information to received packets (LQI, RSSI, gain, time stamp, and packet status)
IEEE 802.15.4-2003 timing and slotted/unslotted timing
4.4
4.5
4.6
Packet Trace Interface (PTI)
The EM260 integrates a true PHY-level PTI for effective network-level debugging. This two-signal interface
monitors all the PHY TX and RX packets (in a non-intrusive manner) between the MAC and baseband modules.
It is an asynchronous 500kbps interface and cannot be used to inject packets into the PHY/MAC interface. The
two signals from the EM260 are the frame signal (PTI_EN) and the data signal (PTI_DATA). The PTI is supported
by Ember Desktop.
XAP2b Microprocessor
The EM260 integrates the XAP2b microprocessor developed by Cambridge Consultants Ltd., making it a true
network processor solution. The XAP2b is a 16-bit Harvard architecture processor with separate program and
data address spaces. The word width is 16 bits for both the program and data sides.
The standard XAP2 microprocessor and accompanying software tools have been enhanced to create the XAP2b
microprocessor used in the EM260. The XAP2b adds data-side byte addressing support to the XAP2 allowing for
more productive usage of RAM and optimized code.
The XAP2b clock speed is 12MHz. When used with the EmberZNet PRO stack, firmware may be loaded into
Flash memory using the SIF mechanism (described in section 7) or over the air or by a serial link using a built-
in bootloader 1 in a reserved area of the Flash. Alternatively, firmware may be loaded via the SIF interface
with the assistance of RAM-based utility routines also loaded via SIF.
Embedded Memory
The EM260 contains embedded Flash and RAM memory for firmware storage and execution. In addition it
partitions a portion of the Flash for Simulated EEPROM and token storage.
4.6.1
Simulated EEPROM
The EmberZNet PRO stack reserves a section of Flash memory to provide Simulated EEPROM storage area for
stack and customer tokens. The Flash cell has been qualified for a data retention time of >100 years at room
temperature and is rated to have a guaranteed 1,000 write/erase cycles. Because the Flash cells are qualified
for up to 1,000 write cycles, the Simulated EEPROM implements an effective wear-leveling algorithm which
effectively extends the number of write cycles for individual tokens.
The number of set-token operations is finite due to the write cycle limitation of the Flash. It is not possible to
guarantee an exact number of set-token operations because the life of the Simulated EEPROM depends on
which tokens are written and how often.
The EM260 stores non-volatile information necessary for network operation as well as 8 tokens available to the
Host (see document UG100, EZSP Reference Guide ). The majority of internal tokens is only written when the
EM260 performs a network join or leave operation. As a simple ballpark estimate of possible set-token
1
See document UG103.6, Ember Application Development Fundamentals: Bootloading , for more information
on the bootloader.
Page 17
120-0260-000M Rev 1.1
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