参数资料
| 型号： | EP2AGX190FF35C5N |
| 厂商： | Altera |
| 文件页数： | 70/90页 |
| 文件大小： | 0K |
| 描述： | IC ARRIA II GX 190K 1152FBGA |
| 产品培训模块： | Three Reasons to Use FPGA's in Industrial Designs |
| 标准包装： | 3 |
| 系列： | Arria II GX |
| LAB/CLB数： | 7612 |
| 逻辑元件/单元数： | 181165 |
| RAM 位总计： | 10177536 |
| 输入/输出数： | 612 |
| 电源电压： | 0.87 V ~ 0.93 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 1152-BBGA |
| 供应商设备封装： | 1152-FBGA（27x27） |
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1–64
Chapter 1: Device Datasheet for Arria II Devices
Switching Characteristics
December 2013
Altera Corporation
Table 1–54 lists the high-speed I/O timing for Arria II GZ devices.
fHSDR (data rate)
SERDES factor
J = 3 to 10
945
945
740
640
Mbps
SERDES factor
J = 2 (using
DDR registers)
Mbps
SERDES factor
J = 1 (using
SDR registers)
Mbps
Soft-CDR PPM
tolerance
Soft-CDR
mode
—
300
—
300
—
300
—
300
PPM
DPA run length
DPA mode
—
10,000
—
10,000
—
10,000
—
10,000
UI
Sampling
window (SW)
Non-DPA mode
—
300
—
300
—
350
—
400
ps
Notes to Table 1–53:
(1) fHSCLK_IN = fHSDR / W. Use W to determine the supported selection of input reference clock frequencies for the desired data rate.
(2) Applicable for interfacing with DPA receivers only. For interfacing with non-DPA receivers, you must calculate the leftover timing margin in the
receiver by performing link timing closure analysis. For Arria II GX transmitter to Arria II GX non-DPA receiver, the maximum supported data
rate is 945 Mbps. For data rates above 840 Mbps, perform PCB trace compensation by adjusting the PCB trace length for LVDS channels to
improve channel-to-channel skews.
(3) The minimum and maximum specification depends on the clock source (for example, PLL and clock pin) and the clock routing resource you
use (global, regional, or local). The I/O differential buffer and input register do not have a minimum toggle rate.
(4) The specification is only applicable under the influence of core noise.
(5) Applicable for true LVDS using dedicated SERDES only.
(6) Dedicated SERDES and DPA features are only available on the right banks.
(7) You must calculate the leftover timing margin in the receiver by performing link timing closure analysis. You must consider the board skew
margin, transmitter channel-to-channel skew, and the receiver sampling margin to determine the leftover timing margin.
Table 1–53. High-Speed I/O Specifications for Arria II GX Devices (Part 4 of 4)
Symbol
Conditions
I3
C4
C5,I5
C6
Unit
Min
Max
Min
Max
Min
Max
Min
Max
Table 1–54. High-Speed I/O Specifications for Arria II GZ Devices (Note 1), (2), (10) (Part 1 of 3)
Symbol
Conditions
C3, I3
C4, I4
Unit
Min
Typ
Max
Min
Typ
Max
Clock
fHSCLK_in (input clock
frequency) true
differential I/O
standards
Clock boost factor
W = 1 to 40 (3)
5
—
717
5
—
717
MHz
fHSCLK_in (input clock
frequency) single
ended I/O standards
Clock boost factor
W = 1 to 40 (3)
5
—
717
5
—
717
MHz
fHSCLK_in (input clock
frequency) single
ended I/O standards
Clock boost factor
W = 1 to 40 (3)
5
—
420
5
—
420
MHz
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相关代理商/技术参数 |
参数描述 |
|---|---|
| EP2AGX190FF35C6 | 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 7612 LABs 612 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EP2AGX190FF35C6N | 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 7612 LABs 612 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EP2AGX190FF35C6NGA | 制造商:Altera 功能描述:EP2AGX190FF35C6NGA |
| EP2AGX190FF35I3 | 功能描述:IC ARRIA II GX 190K 1152FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Arria II GX 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA（34.55x34.55） |
| EP2AGX190FF35I3N | 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 7612 LABs 612 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
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