参数资料
型号: EPF10K200SFC484-1X
厂商: Altera
文件页数: 2/100页
文件大小: 0K
描述: IC FLEX 10KS FPGA 200K 484-FBGA
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 60
系列: FLEX-10KE®
LAB/CLB数: 1248
逻辑元件/单元数: 9984
RAM 位总计: 98304
输入/输出数: 369
门数: 513000
电源电压: 2.375 V ~ 2.625 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 484-BGA
供应商设备封装: 484-FBGA(23x23)
其它名称: EPF10K200SFC4841X
10
Altera Corporation
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
Embedded Array Block
The EAB is a flexible block of RAM, with registers on the input and output
ports, that is used to implement common gate array megafunctions.
Because it is large and flexible, the EAB is suitable for functions such as
multipliers, vector scalars, and error correction circuits. These functions
can be combined in applications such as digital filters and
microcontrollers.
Logic functions are implemented by programming the EAB with a read-
only pattern during configuration, thereby creating a large LUT. With
LUTs, combinatorial functions are implemented by looking up the results,
rather than by computing them. This implementation of combinatorial
functions can be faster than using algorithms implemented in general
logic, a performance advantage that is further enhanced by the fast access
times of EABs. The large capacity of EABs enables designers to implement
complex functions in one logic level without the routing delays associated
with linked LEs or field-programmable gate array (FPGA) RAM blocks.
For example, a single EAB can implement any function with 8 inputs and
16 outputs. Parameterized functions such as LPM functions can take
advantage of the EAB automatically.
The FLEX 10KE EAB provides advantages over FPGAs, which implement
on-board RAM as arrays of small, distributed RAM blocks. These small
FPGA RAM blocks must be connected together to make RAM blocks of
manageable size. The RAM blocks are connected together using
multiplexers implemented with more logic blocks. These extra
multiplexers cause extra delay, which slows down the RAM block. FPGA
RAM blocks are also prone to routing problems because small blocks of
RAM must be connected together to make larger blocks. In contrast, EABs
can be used to implement large, dedicated blocks of RAM that eliminate
these timing and routing concerns.
The FLEX 10KE enhanced EAB adds dual-port capability to the existing
EAB structure. The dual-port structure is ideal for FIFO buffers with one
or two clocks. The FLEX 10KE EAB can also support up to 16-bit-wide
RAM blocks and is backward-compatible with any design containing
FLEX 10K EABs. The FLEX 10KE EAB can act in dual-port or single-port
mode. When in dual-port mode, separate clocks may be used for EAB read
and write sections, which allows the EAB to be written and read at
different rates. It also has separate synchronous clock enable signals for
the EAB read and write sections, which allow independent control of
these sections.
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EPF10K200SFC484-2 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 1248 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K200SFC484-2N 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 1248 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K200SFC484-2X 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 1248 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K200SFC484-3 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 1248 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K200SFC484-3N 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 1248 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256