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参数资料
| 型号： | EV-ADF4156SD1Z |
| 厂商： | Analog Devices Inc |
| 文件页数： | 14/24页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR ADF4156 |
| 标准包装： | 1 |
| 主要目的： | 计时，频率合成器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | ADF4156 |
| 主要属性： | 单路分数-N PLL |
| 次要属性： | 6.2GHz |
| 已供物品： | 板，CD |
Data Sheet
ADF4156
Rev. E | Page 21 of 24
INTERFACING
The ADF4156 has a simple SPI-compatible serial interface for
writing to the device. CLOCK, DATA, and LE control the data
transfer. When latch enable (LE) is high, the 29 bits that have
been clocked into the input register on each rising edge of serial
clock are transferred to the appropriate latch. The maximum
allowable serial clock rate is 20 MHz. See Figure 2 for the timing
diagram and Table 6 for the latch truth table.
PCB DESIGN GUIDELINES FOR CHIP SCALE
PACKAGE
The lands on the lead frame chip scale package (CP-20-6) are
rectangular. The printed circuit board pad for these lands should be
0.1 mm longer than the package land length and 0.05 mm wider
than the package land width. The package land should be centered
on the pad to ensure that the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be a clearance of at least 0.25 mm between the thermal
pad and the inner edges of the pad pattern to ensure that shorting
is avoided.
Thermal vias can be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad on a 1.2 mm
pitch grid. The via diameter should be between 0.3 mm and
0.33 mm, and the via barrel should be plated with 1 oz of
copper to plug the via. In addition, the printed circuit board
thermal pad should be connected to AGND.
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| EV-ADF4157SD1Z | 功能描述:BOARD EVAL FOR ADF4157 RoHS:是 类别:编程器，开发系统 >> 评估演示板和套件 系列:- 标准包装:1 系列:- 主要目的:电信，线路接口单元（LIU） 嵌入式:- 已用 IC / 零件:IDT82V2081 主要属性:T1/J1/E1 LIU 次要属性:- 已供物品:板，电源，线缆，CD 其它名称:82EBV2081 |
| EV-ADF4159EB1Z | 制造商:Analog Devices 功能描述:EVALUATION BOARD - Boxed Product (Development Kits) 制造商:Analog Devices 功能描述:EVAL BOARD FOR ADF4159 |
| EV-ADF4159EB2Z | 制造商:Analog Devices 功能描述:13GHZFRAC-NPLL+ADF55XXVCO+3VADM - Boxed Product (Development Kits) |
| EV-ADF4159EB3Z | 制造商:Analog Devices 功能描述:EVALUATIONBOARD - Boxed Product (Development Kits) 制造商:Analog Devices 功能描述:EVAL BOARD FOR ADF4159 制造商:Analog Devices 功能描述:Clock & Timer Development Tools ADF4159 EVAL BRD |
| EV-ADF4360-0EB1Z | 功能描述:BOARD EVAL FOR ADF4360-0 RoHS:是 类别:编程器，开发系统 >> 评估演示板和套件 系列:- 标准包装:1 系列:- 主要目的:电信，线路接口单元（LIU） 嵌入式:- 已用 IC / 零件:IDT82V2081 主要属性:T1/J1/E1 LIU 次要属性:- 已供物品:板，电源，线缆，CD 其它名称:82EBV2081 |
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