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参数资料
| 型号： | EVAL-AD5111SDZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 2/24页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR AD5111 |
| 标准包装： | 1 |
| 主要目的： | 数字电位器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | AD5111 |
| 主要属性： | 1 通道，128 位置 |
| 次要属性： | 串行接口 |
| 已供物品： | 板，CD |
AD5111/AD5113/AD5115
Data Sheet
Rev.
| Page 10 of 24
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 6.
Parameter
Rating
VDD to GND
–0.3 V to +7.0 V
VLOGIC to GND
–0.3 V to +7.0 V
VA, VW, VB to GND
GND 0.3 V to VDD + 0.3 V
IA, IW, IB
Frequency > 10 kHz
RAW = 5 kΩ and 10 kΩ
±6 mA/d2
RAW = 80 kΩ
±1.5 mA/d2
Frequency ≤ 10 kHz
RAW = 5 kΩ and 10 kΩ
±6 mA/√d2
RAW = 80 kΩ
±1.5 mA/√d2
Continuous
RAW = 5 kΩ and 10 kΩ
±6 mA
RAW = 80 kΩ
±1.5 mA
Digital Inputs U/D, CLK, and CS
0.3 V to +7 V or VDD + 0.3 V
(whichever is less)
Operating Temperature Range3
40°C to +125°C
Maximum Junction Temperature (TJ Max)
150°C
Storage Temperature Range
65°C to +150°C
Reflow Soldering
Peak Temperature
260°C
Time at Peak Temperature
20 sec to 40 sec
Package Power Dissipation
(TJ max TA)/θJA
1 Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2 Pulse duty factor.
3 Includes programming of EEPROM memory.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is defined by JEDEC specification JESD-51, and the value is
dependent on the test board and test environment.
Table 7. Thermal Resistance
Package Type
θJA
θJC
Unit
8-Lead LFCSP
25
°C/W
1 JEDEC 2S2P test board, still air (0 m/sec air flow).
ESD CAUTION
A
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