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参数资料
| 型号： | EVAL-AD7923CBZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 21/24页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR AD7923 |
| 标准包装： | 1 |
| ADC 的数量： | 1 |
| 位数： | 12 |
| 采样率（每秒）： | 200k |
| 数据接口： | 串行 |
| 输入范围： | 0 ~ 2.5 V |
| 在以下条件下的电源（标准）： | 7.5mW @ 200kSPS，5 V |
| 工作温度： | -40°C ~ 125°C |
| 已用 IC / 零件： | AD7923 |
| 已供物品： | 板，CD |
| 相关产品： | AD7923BRUZ-REEL7TR-ND - IC ADC 12BIT 4CH W/SEQ 16TSSOP AD7923BRUZ-REEL-ND - IC ADC 12BIT 4CH W/SEQ 16TSSOP AD7923BRUZ-ND - IC ADC 12BIT 4CH W/SEQ 16TSSOP |
AD7923
Data Sheet
Rev. D | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
AVDD to AGND
0.3 V to +7 V
VDRIVE to AGND
0.3 V to AVDD + 0.3 V
Analog Input Voltage to AGND
0.3 V to AVDD + 0.3 V
Digital Input Voltage to AGND
0.3 V to +7 V
Digital Output Voltage to AGND
0.3 V to AVDD + 0.3 V
REFIN to AGND
0.3 V to AVDD + 0.3 V
Input Current to Any Pin Except
Supplies1
±10 mA
Operating Temperature Range
Commercial (B Version)
40°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
TSSOP Package, Power Dissipation
450 mW
θJA Thermal Impedance
150.4°C/W (TSSOP)
θJC Thermal Impedance
27.6°C/W (TSSOP)
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
Pb-free Temperature, Soldering
Reflow
260(+0)°C
ESD
1.5 kV
1
Transient currents of up to 100 mA do not cause SCR latchup.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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