参数资料
| 型号： | EX256-TQG100 |
| 厂商： | Microsemi SoC |
| 文件页数： | 39/48页 |
| 文件大小： | 0K |
| 描述： | IC FPGA ANTIFUSE 12K 100-TQFP |
| 标准包装： | 90 |
| 系列： | EX |
| 逻辑元件/单元数： | 512 |
| 输入/输出数： | 81 |
| 门数： | 12000 |
| 电源电压： | 2.3 V ~ 2.7 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 100-LQFP |
| 供应商设备封装： | 100-TQFP（14x14） |
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Datasheet Information
3-2
Revision 10
v4.0
(continued)
The "Flexible Mode" section was updated.
The "TRST Pin" section was updated.
The "Probing Capabilities" section is new.
The "Programming" section was updated.
The "Probing Capabilities" section was updated.
The "Silicon Explorer II Probe" section was updated.
The "Design Considerations" section was updated.
The "Development Tool Support" section was updated.
The "Absolute Maximum Ratings*" section was updated.
The "Temperature and Voltage Derating Factors" section was updated.
The "TDI, I/O Test Data Input" section was updated.
The "TDO, I/O Test Data Output" section was updated.
The "TMS Test Mode Select" section was updated.
The "TRST, I/O Boundary Scan Reset Pin" section was updated.
All VSV pins were changed to VCCA. The change affected the following pins:
64-Pin TQFP –
Pin 36
100-Pin TQFP –
Pin 57
49-Pin CSP –
Pin D5
128-Pin CSP–
Pin H11 and Pin J1 for eX256
180-Pin CSP –
Pins J12 and K2
v3.0
The "Recommended Operating Conditions" section has been changed.
The "3.3 V LVTTL Electrical Specifications" section has been updated.
The "5.0 V TTL Electrical Specifications" section has been updated.
The "Total Dynamic Power (mW)" section is new.
The "eX Timing Model" section has been updated.
v2.0.1
The I/O Features table, Table 1-2 on page 1-6, was updated.
= 2.5 V, TJ = 25° C" section, was updated.
"Typical eX Standby Current at 25°C" section is a new table.
The table in the section, "Package Thermal Characteristics" section has been updated
for the 49-Pin CSP.
The "eX Timing Model" section has been updated.
The timing numbers found in, "eX Family Timing Characteristics" section have been
updated.
Please see the following pin tables for the VSV pin and an important footnote including
2-6, 2-11
The figure, "TQ64" section has been updated.
Revision
Changes
Page
相关PDF资料 |
PDF描述 |
|---|---|
| AYM31DTMN | CONN EDGECARD 62POS R/A .156 SLD |
| M1A3P400-FGG256 | IC FPGA 1KB FLASH 400K 256-FBGA |
| M1A3P400-FG256 | IC FPGA 1KB FLASH 400K 256-FBGA |
| A3P250L-1PQG208 | IC FPGA 1KB FLASH 250K 208-PQFP |
| AGM31DTMN | CONN EDGECARD 62POS R/A .156 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| EX256-TQG100A | 功能描述:IC FPGA ANTIFUSE 12K 100-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:EX 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| EX256-TQG100I | 功能描述:IC FPGA ANTIFUSE 12K 100-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:EX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17） |
| EX256-TQG100PP | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:eX Family FPGAs |
| EX-257-B-2 | 制造商:COOPER INDUSTRIES 功能描述:EXT 3/8 FMALE SQ DRV 1/4 MALE |
| EX-25-X-B-1-0-16-M16 | 制造商:Amphenol Aerospace 功能描述:CABLE GLAND, AMPHE-EX, SIZE 16 |
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