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参数资料
| 型号： | FAN5069EMTCX |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 4/22页 |
| 文件大小： | 622K |
| 描述： | IC REG DL BCK/LINEAR 16TSSOP |
| 产品变化通告： | Metallization Mask Rev 18/Apr/2007 |
| 标准包装： | 2,500 |
| 拓扑： | 降压（降压）同步（1），线性（LDO）（1） |
| 功能： | 任何功能 |
| 输出数： | 2 |
| 频率 - 开关： | 200kHz |
| 电压/电流 - 输出 1： | 控制器 |
| 电压/电流 - 输出 2： | 控制器 |
| 带 LED 驱动器： | 无 |
| 带监控器： | 无 |
| 带序列发生器： | 无 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | * |
| 封装/外壳： | 16-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | * |
| 包装： | 带卷 (TR) |
?2005 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN5069 Rev. 1.1.5
4
Absolute Maximum Ratings
The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The
device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are
not guaranteed at the absolute maximum ratings. The Recommended Operating Conditions table defines the condi-
tions for actual device operation.
(1)
Notes:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This
is a stress rating only; functional operation of the device at these or any conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are referenced to AGND.
2. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).
Thermal Information
Notes:
3. Junction-to-ambient thermal resistance, ?/DIV>
JA
, is a strong function of PCB material, board thickness, thickness and
number of copper planes, number of vias used, diameter of vias used, available copper surface, and attached heat
sink characteristics.
Recommended Operating Conditions
Parameter
Min.
Max.
Unit
V
CC
to PGND
6.0
V
BOOT to PGND
33.0
V
SW to PGND
Continuous
-0.5
33.0
V
Transient (t < 50nS, F < 500kHz)
-3.0
33.0
V
HDRV (V
BOOT
- V
SW
)
6.0
V
LDRV
-0.5
6.0
V
All Other Pins
-0.3
V
CC
+ 0.3
V
Maximum Shunt Current for V
CC
150
mA
Electrostatic Discharge Protection (ESD)
Level
(2)
HBM
3.5
kV
CDM
1.8
Symbol
Parameter
Min.
Typ.
Max.
Unit
T
STG
Storage Temperature
-65
150
癈
T
L
Lead Soldering Temperature, 10 Seconds
300
癈
Vapor Phase, 60 Seconds
215
癈
Infrared, 15 Seconds
220
癈
P
D
Power Dissipation, T
A
= 25癈
715
mW
?/DIV>
JC
Thermal Resistance, Junction-to-Case
37
癈/W
?/DIV>
JA
Thermal Resistance, Junction-to-Ambient
(3)
100
癈/W
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
V
CC
Supply Voltage
V
CC
to GND
4.5
5.0
5.5
V
T
A
Ambient Temperature
Commercial
-10
85
癈
Industrial
-40
85
癈
T
J
Junction Temperature
125
癈
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