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| 型号： | FDC6310P |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 2/5页 |
| 文件大小： | 0K |
| 描述： | MOSFET P-CH DUAL 20V SSOT-6 |
| 产品培训模块： | High Voltage Switches for Power Processing |
| 产品变化通告： | Mold Compound Change 08/April/2008 |
| 标准包装： | 1 |
| 系列： | PowerTrench® |
| FET 型： | 2 个 P 沟道（双） |
| FET 特点： | 逻辑电平门 |
| 漏极至源极电压(Vdss)： | 20V |
| 电流 - 连续漏极(Id) @ 25° C： | 2.2A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 125 毫欧 @ 2.2A，4.5V |
| Id 时的 Vgs(th)（最大）： | 1.5V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 5.2nC @ 4.5V |
| 输入电容 (Ciss) @ Vds： | 337pF @ 10V |
| 功率 - 最大： | 700mW |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-6 细型，TSOT-23-6 |
| 供应商设备封装： | 6-SSOT |
| 包装： | 标准包装 |
| 其它名称： | FDC6310PFSDKR |
Electrical Characteristics
T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ Max Units
Off Characteristics
BV DSS
? BV DSS
? T J
I DSS
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
V GS = 0 V, I D = –250 μ A
I D = –250 μ A, Referenced to 25 ° C
V DS = –16 V, V GS = 0 V
–20
–11
–1
V
mV/ ° C
μ A
I GSSF
Gate–Body Leakage, Forward
V GS = 12 V,
V DS = 0 V
100
nA
I GSSR
Gate–Body Leakage, Reverse
V GS = –12 V, V DS = 0 V
–100
nA
On Characteristics
(Note 2)
V GS(th)
? V GS(th)
? T J
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
V DS = V GS , I D = –250 μ A
I D = –250 μ A, Referenced to 25 ° C
–0.6
–1.0
3
–1.5
V
mV/ ° C
R DS(on)
Static Drain–Source
V GS = –4.5 V,
I D = –2.2 A
100
125
m ?
On–Resistance
V GS = –2.5 V, I D = –1.8 A
V GS =–4.5 V, I D =–2.2 A, T J =125 ° C
145
137
190
184
I D(on)
g FS
On–State Drain Current
Forward Transconductance
V GS = –4.5 V,
V DS = –5 V,
V DS = –5 V
I D = –3.5 A
–6
6
A
S
Dynamic Characteristics
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V DS = –10 V,
f = 1.0 MHz
V GS = 0 V,
337
88
51
pF
pF
pF
Switching Characteristics
(Note 2)
t d(on)
t r
t d(off)
t f
Q g
Q gs
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
V DD = –10 V,
V GS = –4.5 V,
V DS = –10 V,
V GS = –4.5 V
I D = –1 A,
R GEN = 6 ?
I D = –2.2 A,
9
12
10
5
3.7
0.65
18
22
20
10
5.2
ns
ns
ns
ns
nC
nC
Q gd
Gate–Drain Charge
1.3
nC
Drain–Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain–Source Diode Forward Current
–0.8
A
V SD
Drain–Source Diode Forward
Voltage
V GS = 0 V, I S = –0.8 A
(Note 2)
0.77
–1.2
V
Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R θ JC is guaranteed by design while R θ CA is determined by the user's board design.
a) 130 ° C/W when
mounted on a 0.125
in 2 pad of 2 oz.
copper.
b) 140°/W when mounted
on a .004 in 2 pad of 2 oz
copper
c) 180°/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300 μ s, Duty Cycle < 2.0%
FDC6310P Rev C(W)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| FDC6310P_Q | 功能描述:MOSFET Dual P-Ch 2.5V Spec Power Trench RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube |
| FDC6312P | 功能描述:MOSFET SSOT-6 P-CH DUAL RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube |
| FDC6312P | 制造商:Fairchild Semiconductor Corporation 功能描述:MOSFET |
| FDC6312P_Q | 功能描述:MOSFET SSOT-6 P-CH DUAL RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube |
| FDC6318 | 制造商:FAIRCHILD 制造商全称:Fairchild Semiconductor 功能描述:Dual P-Channel 1.8V PowerTrench Specified MOSFET |
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