参数资料
型号: FDG313N_D87Z
厂商: Fairchild Semiconductor
文件页数: 2/5页
文件大小: 0K
描述: MOSFET N-CH 25V 0.95A SC70-6
产品变化通告: Mold Compound Change 12/Dec/2007
Mold Compound Change 07/May/2008
Product Discontinuation 03/Dec/2009
标准包装: 10,000
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 25V
电流 - 连续漏极(Id) @ 25° C: 950mA
开态Rds(最大)@ Id, Vgs @ 25° C: 450 毫欧 @ 500mA,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 2.3nC @ 4.5V
输入电容 (Ciss) @ Vds: 50pF @ 10V
功率 - 最大: 480mW
安装类型: 表面贴装
封装/外壳: 6-TSSOP,SC-88,SOT-363
供应商设备封装: SC-70-6
包装: 带卷 (TR)
DMOS E lectrical       Characteristic s
T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max Units
Off Characteristics
BV DSS
? BV DSS
? T J
I DSS
I GSS
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
V GS = 0 V, I D = 250 μ A
I D = 250 μ A, Referenced to 25 ° C
V DS = 20 V, V GS = 0 V
V GS = 8 V, V DS = 0 V
25
30
1
100
V
mV/ ° C
μ A
nA
On Characteristics
(Note 2)
V GS(th)
? V GS(th)
? T J
R DS(on)
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain-Source
On-Resistance
V DS = V GS , I D = 250 μ A
I D = 250 μ A, Referenced to 25 ° C
V GS = 4.5 V, I D = 0.5 A
V GS = 4.5 V, I D = 0.5 A @ 125 ° C
0.65
0.8
-2
0.35
0.53
1.5
0.45
0.76
V
mV/ ° C
?
V GS = 2.7 V, I D = 0.2 A
0.45
0.6
I D(on)
g FS
On-State Drain Current
Forward Transconductance
V GS = 4.5 V, V DS = 5 V
V DS = 5 V, I D = 0.5 A
0.5
1.5
A
S
Dynamic Characteristics
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V DS = 10 V, V GS = 0 V,
f = 1.0 MHz
50
28
9
pF
pF
pF
Switching Characteristics
(Note 2)
t d(on)
t r
t d(off)
t f
Q g
Q gs
Q gd
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 6 V, I D = 0.5 A,
V GS = 4.5 V, R GEN = 50 ?
V DS = 5 V, I D = 0.95 A,
V GS = 4.5 V
3
8.5
17
13
1.64
0.38
0.45
6
18
30
25
2.3
ns
ns
ns
ns
nC
nC
nC
Drain-Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain-Source Diode Forward Current
0.6
A
V SD
Drain-Source Diode Forward Voltage
V GS = 0 V, I S = 0.6 A
(Note 2)
0.8
1.2
V
Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the
drain pins. R θ JC is guaranteed by design while R θ JA is determined by the user's board design.
a) 170 ° C/W when
mounted on a 1 in 2
pad of 2oz copper.
b) 225 ° C/W when
mounted on a half
of package sized 2oz.
c) 260 ° C/W when
mounted on a minimum
pad of 2oz copper.
copper.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width ≤ 300 μ s, Duty Cycle ≤ 2.0%
FDG313N Rev. C
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