参数资料
型号: FDG6308P
厂商: Fairchild Semiconductor
文件页数: 4/4页
文件大小: 0K
描述: MOSFET P-CH DUAL 20V SC70-6
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Mold Compound Change 12/Dec/2007
Mold Compound Change 07/May/2008
标准包装: 3,000
系列: PowerTrench®
FET 型: 2 个 P 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 600mA
开态Rds(最大)@ Id, Vgs @ 25° C: 400 毫欧 @ 600mA,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 2.5nC @ 4.5V
输入电容 (Ciss) @ Vds: 153pF @ 10V
功率 - 最大: 300mW
安装类型: 表面贴装
封装/外壳: 6-TSSOP,SC-88,SOT-363
供应商设备封装: SC-70-6
包装: 带卷 (TR)
其它名称: FDG6308P-ND
FDG6308PTR
Typical Characteristics
5
200
4
I D = -0.6A
V DS = -5V
-10V
160
C ISS
f = 1MHz
V GS = 0 V
-15V
3
2
1
0
120
80
40
0
C OSS
C RSS
0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
0
4
8
12
16
20
Q g , GATE CHARGE (nC)
Figure 7. Gate Charge Characteristics.
10
30
-V DS , DRAIN TO SOURCE VOLTAGE (V)
Figure 8. Capacitance Characteristics.
SINGLE PULSE
1
R DS(ON) LIMIT
1ms
100 μ s
24
R θ JA = 415 o C/W
T A = 25 o C
10ms
100ms
1s
18
12
0.1
0.01
V GS = -4.5V
SINGLE PULSE
R θ JA = 415 o C/W
T A = 25 o C
DC
6
0
0.1
1
10
100
0.0001
0.001
0.01
0.1
1
10
100
-V DS , DRAIN-SOURCE VOLTAGE (V)
Figure 9. Maximum Safe Operating Area.
SINGLE PULSE TIME (SEC)
Figure 10. Single Pulse Maximum
Power Dissipation.
1
D = 0.5
0.2
R θ JA (t) = r(t) + R θ JA
R θ JA = 415 °C/W
0.1
0.1
0.05
P(pk)
0.01
0.001
0.02
0.01
SINGLE PULSE
t 1
t 2
T J - T A = P * R θ JA (t)
Duty Cycle, D = t 1 / t 2
0.0001
0.001
0.01
0.1
1
10
100
t 1 , TIME (sec)
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1.
Transient thermal response will change depending on the circuit board design.
FDG6308P Rev C (W)
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