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| 型号： | FDMS86101 |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 2/7页 |
| 文件大小： | 0K |
| 描述： | MOSFET N-CH 100V 12.4A POWER56 |
| 产品变化通告： | Power 56 Pkg/Design Change 14/Apr/2009 |
| 产品目录绘图： | Power56 Single |
| 标准包装： | 1 |
| 系列： | PowerTrench® |
| FET 型： | MOSFET N 通道，金属氧化物 |
| FET 特点： | 逻辑电平门 |
| 漏极至源极电压(Vdss)： | 100V |
| 电流 - 连续漏极(Id) @ 25° C： | 12.4A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 8 毫欧 @ 13A，10V |
| Id 时的 Vgs(th)（最大）： | 4V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 55nC @ 10V |
| 输入电容 (Ciss) @ Vds： | 3000pF @ 50V |
| 功率 - 最大： | 2.5W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-PQFN，Power56 |
| 供应商设备封装： | Power56 |
| 包装： | 标准包装 |
| 产品目录页面： | 1608 (CN2011-ZH PDF) |
| 其它名称： | FDMS86101DKR |
Electrical Characteristics T J = 25 °C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BV DSS
Δ BV DSS
Δ T J
I DSS
I GSS
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate to Source Leakage Current, Forward
I D = 250 μ A, V GS = 0 V
I D = 250 μ A, referenced to 25 °C
V DS = 80 V, V GS = 0 V
V GS = ±20 V, V DS = 0 V
100
66
800
100
V
mV/°C
nA
nA
On Characteristics
V GS(th)
Δ V GS(th)
Δ T J
Gate to Source Threshold Voltage
Gate to Source Threshold Voltage
Temperature Coefficient
V GS = V DS , I D = 250 μ A
I D = 250 μ A, referenced to 25 °C
2.0
2.9
-9
4.0
V
mV/°C
V GS = 10 V, I D = 13 A
6.3
8
r DS(on)
Static Drain to Source On Resistance
V GS = 6 V, I D = 9.5 A
8.4
13.5
m Ω
V GS = 10 V, I D = 13 A, T J = 125 °C
10.9
14
g FS
Forward Transconductance
V DS = 10 V, I D = 13 A
45
S
Dynamic Characteristics
C iss
C oss
C rss
R g
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
V DS = 50 V, V GS = 0 V,
f = 1 MHz
0.1
2255
460
30
1.0
3000
610
45
3.0
pF
pF
pF
Ω
Switching Characteristics
t d(on)
Turn-On Delay Time
15
27
ns
t r
t d(off)
t f
Q g
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
V DD = 50 V, I D = 13 A,
V GS = 10 V, R GEN = 6 Ω
V GS = 0 V to 10 V
11
27
7
39
20
44
13
55
ns
ns
ns
nC
Q g
Q gs
Total Gate Charge
Gate to Source Charge
V GS = 0 V to 5 V
V DD = 50 V,
I D = 13 A
22
9.5
31
nC
nC
Q gd
Gate to Drain “Miller” Charge
10.8
nC
Drain-Source Diode Characteristics
V SD
Source to Drain Diode Forward Voltage
V GS = 0 V, I S = 2.1 A
V GS = 0 V, I S = 13 A
(Note 2)
(Note 2)
0.7
0.8
1.2
1.3
V
t rr
Q rr
Reverse Recovery Time
Reverse Recovery Charge
I F = 13 A, di/dt = 100 A/ μ s
56
61
90
98
ns
nC
Notes :
1. R θ JA is determined with the device mounted on a 1 in 2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R θ JC is guaranteed by design while R θ CA is determined by
the user's board design.
a. 50 °C/W when mounted on a
1 in 2 pad of 2 oz copper.
b. 125 °C/W when mounted on a
minimum pad of 2 oz copper.
2. Pulse Test: Pulse Width < 300 μ s, Duty cycle < 2.0%.
3. E AS of 173 mJ is based on starting T J = 25 ° C, L = 0.3 mH, I AS = 34 A, V DD = 75 V, V GS = 10 V. 100% test at L = 0.1 mH, I AS = 49 A.
?2013 Fairchild Semiconductor Corporation
FDMS86101 Rev . C9
2
www.fairchildsemi.com
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