参数资料
型号: FDN5630
厂商: Fairchild Semiconductor
文件页数: 2/5页
文件大小: 0K
描述: MOSFET N-CH 60V 1.7A SSOT3
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Wire Bonding Change 07/Nov/2008
Mold Compound Change 08/April/2008
产品目录绘图: SuperSOT-3, SOT-23
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 1.7A
开态Rds(最大)@ Id, Vgs @ 25° C: 100 毫欧 @ 1.7A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 10nC @ 10V
输入电容 (Ciss) @ Vds: 400pF @ 15V
功率 - 最大: 460mW
安装类型: 表面贴装
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商设备封装: 3-SSOT
包装: 标准包装
产品目录页面: 1602 (CN2011-ZH PDF)
其它名称: FDN5630DKR
Electrical Characteristics
T A = 25 C unless otherwise noted
Symbol
Parameter
Test Conditions
Min Typ
Max
Units
Off Characteristics
BV DSS
? BV DSS
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
V GS = 0 V, I D = 250 μ A
I D = 250 μ A,Referenced to 25 ° C
60
63
V
mV/ ° C
? T J
Coefficient
I DSS
I GSSF
Zero Gate Voltage Drain Current
Gate-Body Leakage Current,
V DS = 48 V, V GS = 0 V
V GS = 20 V, V DS = 0 V
1
100
μ A
nA
Forward
I GSSR
Gate-Body Leakage Current,
V GS = -20 V, V DS = 0 V
-100
nA
Reverse
On Characteristics
(Note 2)
V GS(th)
? V GS(th)
Gate Threshold Voltage
Gate Threshold Voltage
V DS = V GS , I D = 250 μ A
I D = 250 μ A,Referenced to 25 ° C
1
2.4
6.9
3
V
mV/ ° C
? T J
Temperature Coefficient
R DS(ON)
Static Drain-Source
On-Resistance
V GS = 10 V, I D = 1.7 A
V GS = 10 V, I D = 1.7 A, T J = 125 ° C
0.073
0.127
0.100
0.180
?
V GS = 6 V, I D = 1.6 A
0.083
0.120
I D(on)
g FS
On-State Drain Current
Forward Transconductance
V GS = 10 V, V DS = 1.7 V
V DS = 10 V, I D = 1.7 A
5
6
A
S
Dynamic Characteristics
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V DS = 15 V, V GS = 0 V,
f = 1.0 MHz
400
102
21
pF
pF
pF
Switching Characteristics
(Note 2)
t d(on)
t r
t d(off)
t f
Q g
Q gs
Q gd
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 30 V, I D = 1 A,
V GS = 10 V, R GEN = 6 ?
V DS = 20 V, I D = 1.7 A,
V GS = 10 V,
10
6
15
5
7
1.6
1.2
20
15
28
15
10
ns
ns
ns
ns
nC
nC
nC
Drain-Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain-Source Diode Forward Current
0.42
A
V SD
Drain-Source Diode Forward
V GS = 0 V, I S = 0.42 A
(Note 2)
0.72
1.2
V
Voltage
Notes:
1: R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting
surface of the drain pins. R θ JC is guaranteed by design while R θ JA is determined by the user's board design.
a) 250 ° C/W when
mounted on a 0.02 in 2
Pad of 2 oz. Cu.
b) 270 ° C/W when
mounted on a minimum
pad.
Scale 1 : 1 on letter size paper
2: Pulse Test: Pulse Width ≤ 300 μ s, Duty Cycle ≤ 2.0%
FDN5630 Rev. C
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