参数资料
型号: FDP036N10A
厂商: Fairchild Semiconductor
文件页数: 1/9页
文件大小: 0K
描述: MOSFET N-CH 100V TO-220AB-3
标准包装: 400
系列: PowerTrench®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 100V
电流 - 连续漏极(Id) @ 25° C: 120A
开态Rds(最大)@ Id, Vgs @ 25° C: 3.6 毫欧 @ 75A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 116nC @ 10V
输入电容 (Ciss) @ Vds: 7295pF @ 25V
功率 - 最大: 227W
安装类型: 通孔
封装/外壳: TO-220-3 成形引线
供应商设备封装: TO-220-3
包装: 管件
November 2013
FDP036N10A
N-Channel PowerTrench ? MOSFET
100 V, 214 A, 3.6 m Ω
Features
? R DS(on) = 3.2 m Ω ( Typ.) @ V GS = 10 V, I D = 75 A
? Fast Switching Speed
? Low Gate Charge, Q G = 89 nC (Typ.)
? High Performance Trench Technology for Extremely Low
R DS(on)
? High Power and Current Handling Capability
? RoHS Compliant
Description
This N-Channel MOSFET is produced using Fairchild Semicon-
ductor ’s PowerTrench ? process that has been tailored to mini-
mize the on-state resistance while maintaining superior
switching performance.
Applications
? Synchronous Rectification for ATX / Server / Telecom PSU
? Battery Protection Circuit
? Motor Drives and Uninterruptible Power Supplies
? Micro Solar Inverter
D
GD
S
TO-220
G
S
MOSFET Maximum Ratings T C = 25 o C unless otherwise noted.
Symbol
V DSS
Drain to Source Voltage
Parameter
FDP036N10A
100
Unit
V
V GSS
I D
Gate to Source Voltage
Drain Current
- Continuous (T C = 25 o C, Silicon Limited)
- Continuous (T C = 100 o C, Silicon Limited)
- Continuous (T C = 25 o C, Package Limited)
±20
214*
151*
120
V
A
I DM
Drain Current
- Pulsed
(Note 1)
856
A
E AS
dv/dt
P D
Single Pulsed Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation
(T C = 25 o C)
- Derate Above 25 o C
(Note 2)
(Note 3)
658
6.0
333
2.22
mJ
V/ns
W
W/ o C
T J , T STG
T L
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds
-55 to +175
300
o
o
C
C
*Calculated continuous current based on maximum allowable junction temperature. Package limitation current is 120A.
Thermal Characteristics
Symbol
Parameter
FDP036N10A
Unit
R θ JC
R θ JA
Thermal Resistance, Junction to Case, Max.
Thermal Resistance, Junction to Ambient, Max.
0.45
62.5
o
C/W
?2010 Fairchild Semiconductor Corporation
FDP036N10A Rev. C1
1
www.fairchildsemi.com
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